公开(公告)号：US20170345576A1

公开(公告)日：2017-11-30

申请号：US15603743

申请日：2017-05-24

Applicant: TDK CORPORATION

Inventor： Atsuhiro TSUYOSHI ,  Akifumi KAMIJIMA

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/012

CPC classification number: H01G4/33 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/10 ,  H01G4/232

Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.

公开(公告)号：US20230397338A1

公开(公告)日：2023-12-07

申请号：US18449095

申请日：2023-08-14

Applicant: TDK Corporation

Inventor： Atsuhiro TSUYOSHI ,  Takashi OHTSUKA ,  Kenichi YOSHIDA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/188 ,  H05K3/305 ,  H05K3/4644 ,  H05K2201/0183

Abstract: An electronic component has: a conductor layer M1 formed on a substrate and including lower electrodes of a capacitor; a dielectric film covering the top and side surfaces of each of the lower electrodes; upper electrodes of the capacitor which are formed on the top surfaces of the respective lower electrodes through the dielectric film; and an adhesive film disposed between the dielectric film and the top and side surfaces of each of the lower electrodes. The adhesive film is thus disposed between the dielectric film and the top and side surfaces of each of the lower electrodes.