MEMS MICROPHONE
    1.
    发明申请
    MEMS MICROPHONE 审中-公开

    公开(公告)号:US20200077201A1

    公开(公告)日:2020-03-05

    申请号:US16509628

    申请日:2019-07-12

    Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.

    MAGNETICALLY ACTUATED MEMS SWITCH

    公开(公告)号:US20210313130A1

    公开(公告)日:2021-10-07

    申请号:US17354432

    申请日:2021-06-22

    Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.

    MAGNETICALLY ACTUATED MEMS SWITCH
    3.
    发明申请

    公开(公告)号:US20190318893A1

    公开(公告)日:2019-10-17

    申请号:US16377418

    申请日:2019-04-08

    Abstract: A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.

    COIL COMPONENT AND POWER SUPPLY CIRCUIT UNIT

    公开(公告)号:US20170316868A1

    公开(公告)日:2017-11-02

    申请号:US15495637

    申请日:2017-04-24

    Inventor: Akifumi KAMIJIMA

    Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.

    COIL COMPONENT AND POWER SUPPLY CIRCUIT UNIT

    公开(公告)号:US20170316867A1

    公开(公告)日:2017-11-02

    申请号:US15495258

    申请日:2017-04-24

    Abstract: Provided is a coil component including a coil portion that has two ring-shaped planar coil portions individually including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, an insulative resin layer being interposed between the planar coil portions adjacent to each other in the stacking direction of the planar coil portions, and a pair of insulative resin layers being respectively positioned on one end side and the other end side of the two planar coil portions in the stacking direction; and a covering portion that covers the coil portion. In regard to the stacking direction, the thickness of the insulative resin layer is thinner than the thickness of each of the pair of insulative resin layers.

    MEMS MICROPHONE MODULE
    6.
    发明申请

    公开(公告)号:US20210127214A1

    公开(公告)日:2021-04-29

    申请号:US17143401

    申请日:2021-01-07

    Abstract: A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.

    METHOD OF PROCESSING INORGANIC MATERIAL SUBSTRATE, DEVICE, AND METHOD OF MANUFACTURING DEVICE

    公开(公告)号:US20200316712A1

    公开(公告)日:2020-10-08

    申请号:US16821485

    申请日:2020-03-17

    Inventor: Akifumi KAMIJIMA

    Abstract: In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.

    MEMS MICROPHONE
    8.
    发明申请
    MEMS MICROPHONE 审中-公开

    公开(公告)号:US20200077202A1

    公开(公告)日:2020-03-05

    申请号:US16509761

    申请日:2019-07-12

    Abstract: MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.

    THIN-FILM CAPACITOR
    9.
    发明申请
    THIN-FILM CAPACITOR 审中-公开

    公开(公告)号:US20180102219A1

    公开(公告)日:2018-04-12

    申请号:US15725860

    申请日:2017-10-05

    Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.

    THIN-FILM CAPACITOR
    10.
    发明申请
    THIN-FILM CAPACITOR 审中-公开

    公开(公告)号:US20170345576A1

    公开(公告)日:2017-11-30

    申请号:US15603743

    申请日:2017-05-24

    CPC classification number: H01G4/33 H01G4/0085 H01G4/012 H01G4/10 H01G4/232

    Abstract: In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.

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