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    Magnetic sensor device and magnetic sensor system
    1.
    发明授权
    Magnetic sensor device and magnetic sensor system 有权

    公开(公告)号：US11946989B2

    公开(公告)日：2024-04-02

    申请号：US18197913

    申请日：2023-05-16

    Applicant: TDK CORPORATION

    Inventor： Norikazu Ota ,  Hiraku Hirabayashi ,  Kazuma Yamawaki ,  Shuhei Miyazaki ,  Kazuya Watanabe

    IPC: G01R33/09 ,  G01R33/02

    CPC classification number: G01R33/098 ,  G01R33/0206 ,  G01R33/093

    Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.

    MAGNETIC SENSOR DEVICE
    2.
    发明公开
    MAGNETIC SENSOR DEVICE 审中-公开

    公开(公告)号：US20240280611A1

    公开(公告)日：2024-08-22

    申请号：US18582196

    申请日：2024-02-20

    Applicant: TDK Corporation

    Inventor： Kazuma Yamawaki

    IPC: G01R15/20 ,  G01B7/30 ,  G01R19/00 ,  G03B13/36 ,  H04N23/68

    CPC classification number: G01R15/207 ,  G01B7/30 ,  G01R19/0092 ,  G03B13/36 ,  H04N23/6812 ,  H04N23/687

    Abstract: A magnetic sensor device with stable output characteristics is provided, which includes: a supporting substrate that has a first face; a magnetic detection element; a protective film, which is a layered film that is disposed on the first face side and that has a first layer of which a primary component is alumina and a second layer of which a primary component is silica; and a wiring layer that is disposed on the first face side and is situated at a position farther from the supporting substrate than the layered film, and moreover extends along the first face. The magnetic detection element is disposed inside the layered film.

    Magnetic sensor device and magnetic sensor system
    3.
    发明授权
    Magnetic sensor device and magnetic sensor system 有权

    公开(公告)号：US11686788B2

    公开(公告)日：2023-06-27

    申请号：US17734674

    申请日：2022-05-02

    Applicant: TDK CORPORATION

    Inventor： Norikazu Ota ,  Hiraku Hirabayashi ,  Kazuma Yamawaki ,  Shuhei Miyazaki ,  Kazuya Watanabe

    IPC: G01R33/09 ,  G01R33/02

    CPC classification number: G01R33/098 ,  G01R33/0206 ,  G01R33/093

    Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.

    Electronic component package
    8.
    发明授权
    Electronic component package 有权

    公开(公告)号：US11569143B2

    公开(公告)日：2023-01-31

    申请号：US16407623

    申请日：2019-05-09

    Applicant: TDK Corporation

    Inventor： Yongfu Cai ,  Shuhei Miyazaki ,  Kazuma Yamawaki

    IPC: H01L23/28 ,  H01L23/498 ,  H01L23/00

    Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).

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