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公开(公告)号：US11789094B2
公开(公告)日：2023-10-17
申请号：US17959392
申请日：2022-10-04
Applicant: TDK CORPORATION
Inventor： Kenzo Makino , Shuhei Miyazaki
IPC: G01R33/02
CPC classification number: G01R33/0206
Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.
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公开(公告)号：US11569143B2
公开(公告)日：2023-01-31
申请号：US16407623
申请日：2019-05-09
Applicant: TDK Corporation
Inventor： Yongfu Cai , Shuhei Miyazaki , Kazuma Yamawaki
IPC: H01L23/28 , H01L23/498 , H01L23/00
Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).
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公开(公告)号：US11686788B2
公开(公告)日：2023-06-27
申请号：US17734674
申请日：2022-05-02
Applicant: TDK CORPORATION
Inventor： Norikazu Ota , Hiraku Hirabayashi , Kazuma Yamawaki , Shuhei Miyazaki , Kazuya Watanabe
CPC classification number: G01R33/098 , G01R33/0206 , G01R33/093
Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.
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公开(公告)号：US11322418B2
公开(公告)日：2022-05-03
申请号：US16685141
申请日：2019-11-15
Applicant: TDK Corporation
Inventor： Yongfu Cai , Shuhei Miyazaki
Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided.
Assembly 10 of stacked elements has: first element 2 having first surface 21; resin layer 61 that is arranged on first surface 21 and that contains a plurality of fillers F; and second element 4 that is arranged on resin layer 61 and that has second surface 41 that is in contact with resin layer 61. In a section that is perpendicular to second surface 41, the average flattening ratio of fillers F2 that are in contact with second surface 41 is larger than the average flattening ratio of fillers F1, F3 that are not in contact with second surface 41. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface 41 to the maximum thickness of the filler in a direction perpendicular to second surface 41.-
公开(公告)号：US12174273B2
公开(公告)日：2024-12-24
申请号：US18243392
申请日：2023-09-07
Applicant: TDK CORPORATION
Inventor： Kenzo Makino , Shuhei Miyazaki
IPC: G01R33/02
Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.
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Patent Agency Ranking
公开(公告)号：US20180275204A1
公开(公告)日：2018-09-27
申请号：US15921969
申请日：2018-03-15
Applicant: TDK Corporation
Inventor： Kunihiro Ueda , Koichi Otani , Hiraku Hirabayashi , Shuhei Miyazaki
CPC classification number: G01R33/0047 , G01R33/0005 , G01R33/07 , G01R33/09 , G01R33/1276 , H01L2224/48247
Abstract: A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.
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公开(公告)号：US12046524B2
公开(公告)日：2024-07-23
申请号：US17696253
申请日：2022-03-16
Applicant: TDK Corporation
Inventor： Yongfu Cai , Shuhei Miyazaki
CPC classification number: H01L23/295 , H01L21/56 , H01L24/19 , H01L24/20
Abstract: In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.
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公开(公告)号：US11946989B2
公开(公告)日：2024-04-02
申请号：US18197913
申请日：2023-05-16
Applicant: TDK CORPORATION
Inventor： Norikazu Ota , Hiraku Hirabayashi , Kazuma Yamawaki , Shuhei Miyazaki , Kazuya Watanabe
CPC classification number: G01R33/098 , G01R33/0206 , G01R33/093
Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.
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公开(公告)号：US11493567B2
公开(公告)日：2022-11-08
申请号：US17218430
申请日：2021-03-31
Applicant: TDK CORPORATION
Inventor： Kenzo Makino , Shuhei Miyazaki
Abstract: A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.
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公开(公告)号：US10527683B2
公开(公告)日：2020-01-07
申请号：US15921969
申请日：2018-03-15
Applicant: TDK Corporation
Inventor： Kunihiro Ueda , Koichi Otani , Hiraku Hirabayashi , Shuhei Miyazaki
Abstract: A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.
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