公开(公告)号：US20230093241A1

公开(公告)日：2023-03-23

申请号：US17909080

申请日：2021-03-04

Applicant: TDK CORPORATION

Inventor： Hiroshi KOIZUMI ,  Yasuo KATO ,  Makoto YAMASHITA ,  Mitsuyoshi MAKIDA ,  Ryo SHINDO ,  Osamu SHINDO ,  Hiroshi IIZUKA ,  Seijiro SUNAGA ,  Toshinobu MIYAGOSHI

IPC: H01L33/00

Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.

公开(公告)号：US20230382070A1

公开(公告)日：2023-11-30

申请号：US18323745

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Mitsuyoshi MAKIDA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Ryo SHINDO ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/062 ,  B30B15/04

Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.