公开(公告)号：US20160178445A1

公开(公告)日：2016-06-23

申请号：US14942136

申请日：2015-11-16

Applicant: TDK CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Satoru SHIRAKI ,  Keiichi KANESHIGE ,  Masashi MATSUMOTO ,  Masayuki IKEMOTO ,  Tsutomu HATAKEYAMA

IPC: G01K1/08 ,  G01K7/22

CPC classification number: G01K1/08 ,  G01K7/22

Abstract: A thermistor includes a case having a bottom section at one end and an opening section at the other end, a thermistor element housed in the case, a conducting wire housed in the case and connected to the thermistor element, and a lead wire connected to the conducting wire.The lead wire has a first portion including an insulating coating, and a second portion connected to the conducting wire and exposed from the insulating coating. A resin is filled up to a position away from an end edge of the opening section toward the bottom section so as to enclose at least the thermistor element, the conducting wire, and the second portion. The first portion is guided out of the resin to the outside of the case. An inner peripheral surface of the opening section is curved so as to increase an opening area of the opening section.

Abstract translation: 一种热敏电阻器包括壳体，其一端具有底部部分和另一端部的开口部分，容纳在壳体中的热敏电阻元件，容纳在壳体中并连接到热敏电阻元件的导线以及连接到该热敏电阻元件的引线 导线。 引线具有包括绝缘涂层的第一部分和连接到导线并从绝缘涂层露出的第二部分。 将树脂填充到远离开口部的端缘的位置朝向底部，以便至少包围热敏电阻元件，导线和第二部分。 将第一部分从树脂导出到壳体的外部。 开口部的内周面弯曲，以增加开口部的开口面积。

公开(公告)号：US20230382069A1

公开(公告)日：2023-11-30

申请号：US18323467

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Osamu SHINDO ,  Hiroshi KOIZUMI ,  Makoto YAMASHITA ,  Yasuo KATO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/04 ,  B30B15/062

Abstract: Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

公开(公告)号：US20230381904A1

公开(公告)日：2023-11-30

申请号：US18323618

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B23Q3/02

CPC classification number: B23Q3/02

Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

公开(公告)号：US20250076835A1

公开(公告)日：2025-03-06

申请号：US18727132

申请日：2023-01-18

Applicant: TDK CORPORATION

Inventor： Ruriko SATO ,  Shinji ATSUZAWA ,  Osamu OHHATA ,  Shingo OZEKI ,  Masashi MATSUMOTO

IPC: G05B19/05

Abstract: An environment in which a control device for controlling a controlled object can easily be verified. This verification system includes: a simulator for simulating an operating state of the controlled object; and a dummy device for generating a second signal relating to the controlled object instead of the simulator or the controlled object, in accordance with a first signal provided from a control device capable of controlling the controlled object, and providing the generated second signal to the control device or the simulator. The simulator generates a third signal indicating the simulated operating state of the controlled object on the basis of the second signal provided from the dummy device.

公开(公告)号：US20230382070A1

公开(公告)日：2023-11-30

申请号：US18323745

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Toshinobu MIYAGOSHI ,  Osamu SHINDO ,  Seijiro SUNAGA ,  Mitsuyoshi MAKIDA ,  Makoto YAMASHITA ,  Yasuo KATO ,  Ryo SHINDO ,  Masashi MATSUMOTO

IPC: B30B12/00 ,  B30B15/04 ,  B30B15/06

CPC classification number: B30B12/00 ,  B30B15/062 ,  B30B15/04

Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.

公开(公告)号：US20230381903A1

公开(公告)日：2023-11-30

申请号：US18323820

申请日：2023-05-25

Applicant: TDK CORPORATION

Inventor： Yohei SATO ,  Hiroshi KOIZUMI ,  Osamu SHINDO ,  Mitsuyoshi MAKIDA ,  Masashi MATSUMOTO

IPC: B23Q1/03

CPC classification number: B23Q1/032

Abstract: A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.