公开(公告)号：US20240128463A1

公开(公告)日：2024-04-18

申请号：US18277430

申请日：2021-02-18

Applicant: TDK CORPORATION

Inventor： Makoto ENDO ,  Mingyu CHEN ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA

IPC: H01M4/66

CPC classification number: H01M4/667 ,  H01M4/661

Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied.


y≥2.5×−7.5  Expression (1)



(in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.)

公开(公告)号：US20200321499A1

公开(公告)日：2020-10-08

申请号：US16794445

申请日：2020-02-19

Applicant: TDK CORPORATION

Inventor： Takasi SATOU ,  Susumu TANIGUCHI ,  Hideyuki KOBAYASHI ,  Makoto ORIKASA

IPC: H01L33/62 ,  H01L23/00

Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.

公开(公告)号：US20240379969A1

公开(公告)日：2024-11-14

申请号：US18696750

申请日：2021-09-30

Applicant: TDK Corporation

Inventor： Ryo SASAKI ,  Makoto ENDO ,  Mignyu CHEN ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA ,  Kosuke TANAKA ,  Shun IKENARI

IPC: H01M4/66 ,  H01M4/13 ,  H01M10/0525 ,  H01M10/42

Abstract: A current collector includes a resin layer, a conductive layer, a first intermediate layer that is positioned between the resin layer and the conductive layer and a second intermediate layer that is positioned between the first intermediate layer and the resin layer, the first intermediate layer includes a metal as a main component, and the second intermediate layer includes a metal oxide as a main component.

公开(公告)号：US20250096280A1

公开(公告)日：2025-03-20

申请号：US18729348

申请日：2022-01-17

Applicant: TDK Corporation

Inventor： Mingyu CHEN ,  Makoto ENDO ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA

IPC: H01M4/66 ,  H01M4/04 ,  H01M10/0525

Abstract: A current collector including: a resin layer having first and second surfaces on opposites sides; and a metal layer including copper. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The yield stress σY1 [MPa] is obtained by expressions (1) and (2) from a resin layer yield stress σY2 [MPa], a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a thickness D3 [μm] of the metal layer: σ ⁢ Y ⁢ 1 = A × σ ⁢ Y ⁢ 3 + ( 1 - A ) × σ ⁢ Y ⁢ 2 ( 1 ) A = D ⁢ 3 / ( D ⁢ 2 + D ⁢ 3 ) . ( 2 ) The yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer σ ⁢ Y ⁢ 3 = ( - 103 + 1 ⁢ 6 ⁢ 44 × √ β ) . ( 3 )

公开(公告)号：US20240047696A1

公开(公告)日：2024-02-08

申请号：US18277471

申请日：2021-02-18

Applicant: TDK CORPORATION

Inventor： Makoto ENDO ,  Mingyu CHEN ,  Yoshihiro KANBAYASHI ,  Takasi SATOU ,  Natsumi KOZAI ,  Yoshihiko TANABE ,  Syuji TSUKAMOTO ,  Miyuki YANAGIDA

IPC: H01M4/66 ,  C23C14/20 ,  C25D3/38 ,  C25D5/56

CPC classification number: H01M4/667 ,  H01M4/661 ,  H01M4/668 ,  C23C14/205 ,  C25D3/38 ,  C25D5/56

Abstract: A laminated resin film includes: a resin layer; and a Cu film having on one surface or both surfaces of the resin layer, in which in the Cu film, an orientation index of a plane is 0.15 or more according to a Lotgering method, a half-width of an X-ray diffraction peak obtained by X-ray diffraction measurement of the plane is 0.3° or less, and Expression (1) is satisfied.


y>3.75x−0.675   Expression (1)

(in Expression (1), Y is the orientation index of the plane in the Cu film according to the Lotgering method, and x is the half-width of the X-ray diffraction peak obtained by the X-ray diffraction measurement of the plane in the Cu film.)