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公开(公告)号:US20240379969A1
公开(公告)日:2024-11-14
申请号:US18696750
申请日:2021-09-30
Applicant: TDK Corporation
Inventor: Ryo SASAKI , Makoto ENDO , Mignyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA , Kosuke TANAKA , Shun IKENARI
IPC: H01M4/66 , H01M4/13 , H01M10/0525 , H01M10/42
Abstract: A current collector includes a resin layer, a conductive layer, a first intermediate layer that is positioned between the resin layer and the conductive layer and a second intermediate layer that is positioned between the first intermediate layer and the resin layer, the first intermediate layer includes a metal as a main component, and the second intermediate layer includes a metal oxide as a main component.
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公开(公告)号:US20240128463A1
公开(公告)日:2024-04-18
申请号:US18277430
申请日:2021-02-18
Applicant: TDK CORPORATION
Inventor: Makoto ENDO , Mingyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
IPC: H01M4/66
Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied.
y≥2.5×−7.5 Expression (1)
(in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.)-
公开(公告)号:US20230361313A1
公开(公告)日:2023-11-09
申请号:US17634391
申请日:2021-03-30
Applicant: TDK Corporation
Inventor: Takuya AOKI , Shuji HIGASHI , Syuji TSUKAMOTO , Keisuke TATSUZAKI , Kosuke TANAKA
IPC: H01M4/13 , H01M4/66 , H01M10/0525 , H01M4/70
CPC classification number: H01M4/70 , H01M4/13 , H01M4/661 , H01M10/0525 , H01M2004/021
Abstract: An electrode for power storage devices includes: a resin layer having a first surface and a second surface that is located on an opposite side from the first surface; a first electrically-conductive layer that is disposed on the first surface side of the resin layer; and a first layer of particles that is disposed on an opposite side of the first electrically-conductive layer from the resin layer. In a cross section parallel to a thickness direction of the resin layer, the first electrically-conductive layer has a first shape including a plurality of protrusions that are convexed toward the resin layer and a recess that is disposed between two adjacent protrusions among the plurality of protrusions. A distance H along the thickness direction from one of top points of the two adjacent protrusions to a bottom point of the recess is smaller than a thickness of the resin layer.
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公开(公告)号:US20250096280A1
公开(公告)日:2025-03-20
申请号:US18729348
申请日:2022-01-17
Applicant: TDK Corporation
Inventor: Mingyu CHEN , Makoto ENDO , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
IPC: H01M4/66 , H01M4/04 , H01M10/0525
Abstract: A current collector including: a resin layer having first and second surfaces on opposites sides; and a metal layer including copper. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The yield stress σY1 [MPa] is obtained by expressions (1) and (2) from a resin layer yield stress σY2 [MPa], a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a thickness D3 [μm] of the metal layer: σ Y 1 = A × σ Y 3 + ( 1 - A ) × σ Y 2 ( 1 ) A = D 3 / ( D 2 + D 3 ) . ( 2 ) The yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer σ Y 3 = ( - 103 + 1 6 44 × √ β ) . ( 3 )
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公开(公告)号:US20240047696A1
公开(公告)日:2024-02-08
申请号:US18277471
申请日:2021-02-18
Applicant: TDK CORPORATION
Inventor: Makoto ENDO , Mingyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
Abstract: A laminated resin film includes: a resin layer; and a Cu film having on one surface or both surfaces of the resin layer, in which in the Cu film, an orientation index of a plane is 0.15 or more according to a Lotgering method, a half-width of an X-ray diffraction peak obtained by X-ray diffraction measurement of the plane is 0.3° or less, and Expression (1) is satisfied.
y>3.75x−0.675 Expression (1)
(in Expression (1), Y is the orientation index of the plane in the Cu film according to the Lotgering method, and x is the half-width of the X-ray diffraction peak obtained by the X-ray diffraction measurement of the plane in the Cu film.)
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