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公开(公告)号：US20240128463A1
公开(公告)日：2024-04-18
申请号：US18277430
申请日：2021-02-18
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Mingyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
IPC: H01M4/66
Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied.
y≥2.5×−7.5 Expression (1)
(in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.)-
公开(公告)号：US20200310170A1
公开(公告)日：2020-10-01
申请号：US16651633
申请日：2018-09-28
Applicant: TDK Corporation
Inventor： Shinji IWATSUKA , Makoto ENDO , Kenji SASAKI
IPC: G02F1/035
Abstract: An optical modulator includes: a substrate; a waveguide layer including first and second optical waveguides formed of an electro-optic material film on the substrate to have a ridge shape and to be disposed adjacent to each other; an RF part that applies a modulated signal to the optical waveguides; and a DC part that applies a DC bias to the optical waveguides. The DC part includes: a buffer layer covering at least upper surfaces of the optical waveguides; a first bias electrode opposed to the first optical waveguide through the buffer layer; and a second bias electrode provided adjacent to the first bias electrode. A first DC bias voltage is applied between the first and second bias electrodes. A waveguide layer removal area in which at least part of the waveguide layer is removed is provided at least under an area between the first and second bias electrodes.
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公开(公告)号：US20130094121A1
公开(公告)日：2013-04-18
申请号：US13650571
申请日：2012-10-12
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Hirobumi TANAKA , Osamu KIDO
IPC: H01G4/008
CPC classification number: H01G4/30 , H01G4/0085 , H01G4/12 , H01G4/1209 , H01G4/1227
Abstract: A compact laminated ceramic electronic component having superior moisture resistance and electrical properties is provided.A laminated ceramic electronic component 1 includes an inner layer portion that contains a plurality of dielectric layers 2a and internal electrode layers 3 comprising Ni as a main component that are laminated alternately, and a pair of dielectric outer layer portions 2b which sandwich the inner layer portions. And Ni particles are segregated in the dielectric outer layer portions 2b. And the amount of Ni particles existing in the dielectric layers 2a is smaller than that in the dielectric outer layer portions 2b.
Abstract translation: 提供了具有优异的耐湿性和电性能的紧凑型层压陶瓷电子部件。 层叠陶瓷电子部件1包括内层部，该内层部包含交替层叠有多个电介质层2a和包含以Ni为主要成分的内部电极层3，以及一对电介质外层部2b，其夹着内层部 。 并且在电介质外层部分2b中分离Ni颗粒。 并且存在于电介质层2a中的Ni粒子的量比电介质外层部分2b的量小。
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4.发明申请公开(公告)号：US20240379969A1
公开(公告)日：2024-11-14
申请号：US18696750
申请日：2021-09-30
Applicant: TDK Corporation
Inventor： Ryo SASAKI , Makoto ENDO , Mignyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA , Kosuke TANAKA , Shun IKENARI
IPC: H01M4/66 , H01M4/13 , H01M10/0525 , H01M10/42
Abstract: A current collector includes a resin layer, a conductive layer, a first intermediate layer that is positioned between the resin layer and the conductive layer and a second intermediate layer that is positioned between the first intermediate layer and the resin layer, the first intermediate layer includes a metal as a main component, and the second intermediate layer includes a metal oxide as a main component.
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公开(公告)号：US20190066900A1
公开(公告)日：2019-02-28
申请号：US16100607
申请日：2018-08-10
Applicant: TDK CORPORATION
Inventor： Masahiro NAKAJIMA , Kenichi HIRENZAKI , Makoto ENDO , Masanori SUZUKI , Tomonaga NISHIKAWA
Abstract: Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.
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Patent Agency Ranking
公开(公告)号：US20180277296A1
公开(公告)日：2018-09-27
申请号：US15934103
申请日：2018-03-23
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Mitsunori HIRAOKA , Kazuhiko ITO
IPC: H01F27/255 , H01F27/28 , H01F41/04 , H01F5/00 , H01F27/29
CPC classification number: H01F27/255 , H01F5/003 , H01F27/2804 , H01F27/292 , H01F41/046
Abstract: There is provided a coil component including a coil portion that has at least one layer of planar coil including a coil-wound portion and an insulative layer which covers the periphery of the coil-wound portion, a covering portion that covers the coil portion and is constituted of a mixture including magnetic fillers and resin, and a conductor post that is penetratingly provided inside the covering portion and extends from the coil-wound portion to an upper surface of the covering portion along an axial direction of the planar coil. The conductor post has a post portion which extends from the coil-wound portion in the axial direction of the planar coil, and a lid portion which is exposed from the covering portion and extends from an end portion of the post portion on the upper surface side along a surface direction of the upper surface.
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公开(公告)号：US20150200055A1
公开(公告)日：2015-07-16
申请号：US14592718
申请日：2015-01-08
Applicant: TDK CORPORATION
Inventor： Keisuke ISHIDA , Koichi YAMAGUCHI , Makoto ENDO , Shimpei TANABE
CPC classification number: H01G4/1218 , H01G4/012 , H01G4/30
Abstract: The present invention is aimed to improve the poor insulation of the laminate-type ceramic electronic component having dielectric ceramic layers of 0.5 μm or less. A laminate-type ceramic electronic component which is a laminated body having a laminated structure formed by laminating the first ceramic parts and the internal electrode layers alternately. The first ceramic parts have a main ingredient of ABO3 representing a perovskite-type crystal in which site A contains at least Ba and site B contains at least Ti. The laminate-type ceramic electronic component has external electrodes which are connected with the internal electrodes. The end edge parts of the internal electrodes other than the end connected with the external electrodes are connected with the second ceramic parts. The second ceramic parts contain aluminum oxide as a main ingredient.
Abstract translation: 本发明旨在改善具有0.5μm以下的电介质陶瓷层的层叠型陶瓷电子部件的绝缘性差。 层叠型陶瓷电子部件，其是通过交替层压第一陶瓷部件和内部电极层而形成的层叠结构的层叠体。 第一陶瓷部件具有代表钙钛矿型晶体的ABO 3的主要成分，其中位点A至少含有Ba，并且位点B含有至少Ti。 层叠型陶瓷电子部件具有与内部电极连接的外部电极。 除了与外部电极连接的端部之外的内部电极的端部边缘部分与第二陶瓷部件连接。 第二陶瓷部件含有氧化铝作为主要成分。
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公开(公告)号：US20240072239A1
公开(公告)日：2024-02-29
申请号：US18268394
申请日：2021-12-13
Applicant: TDK CORPORATION
Inventor： Yuhei HORIKAWA , Makoto ENDO , Takuya KAKIUCHI , Miyuki YANAGIDA , Yuki NAITO , Takahiro TASHIRO
IPC: H01M4/134 , H01M4/66 , H01M10/0525
CPC classification number: H01M4/134 , H01M4/661 , H01M10/0525
Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.
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公开(公告)号：US20170162317A1
公开(公告)日：2017-06-08
申请号：US15363737
申请日：2016-11-29
Applicant: TDK CORPORATION
Inventor： Masamichi TANIGUCHI , Makoto ENDO
CPC classification number: H01F27/2804 , H01F27/255 , H01F27/292 , H01F41/046 , H01F41/10 , H01F2027/2809
Abstract: A coil component includes an element body having a rectangular main surface; a coil provided within the element body, wherein the coil having a lower coil portion and an upper coil portion; terminal electrodes provided at positions corresponding to corners of the main surface; extracting conductors connected within the element body to both end portions of the coil, wherein the extracting conductors extending from the end portions of the coil to terminal electrodes provided on the main surface; and a dummy electrode provided on the main surface at a position different from those of the terminal electrodes, wherein the dummy electrode is conducted to neither of the extracting conductors.
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公开(公告)号：US20170162316A1
公开(公告)日：2017-06-08
申请号：US15363608
申请日：2016-11-29
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Masamichi TANIGUCHI , Katsunori OSANAI
IPC: H01F27/28 , H01F27/245 , H01F27/29 , H01F27/32
CPC classification number: H01F27/2804 , H01F27/245 , H01F27/255 , H01F27/29 , H01F27/292 , H01F27/323 , H01F2027/2809
Abstract: In a coil component, an inorganic layer which is provided on a lower surface side of a coil has a thermal conductivity higher than that of a resin layer with which an upper surface of the coil is covered and gaps between windings are filled. As a result, heat transfer from the inside of the coil to the outside is supplemented via the inorganic layer. That is, heat transfer of the coil via the inorganic layer is facilitated, and heat dissipation of the coil component improves.
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