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公开(公告)号：US20240128463A1
公开(公告)日：2024-04-18
申请号：US18277430
申请日：2021-02-18
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Mingyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
IPC: H01M4/66
Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied.
y≥2.5×−7.5 Expression (1)
(in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.)-
公开(公告)号：US20180114759A1
公开(公告)日：2018-04-26
申请号：US15791888
申请日：2017-10-24
Applicant: TDK Corporation
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Hisayuki ABE , Yoshihiro KANBAYASHI
IPC: H01L23/552 , H01L23/31 , H01L21/56 , H01L21/3205
CPC classification number: H01L23/552 , H01L21/288 , H01L21/32051 , H01L21/565 , H01L23/3121 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.
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3.发明申请公开(公告)号：US20240379969A1
公开(公告)日：2024-11-14
申请号：US18696750
申请日：2021-09-30
Applicant: TDK Corporation
Inventor： Ryo SASAKI , Makoto ENDO , Mignyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA , Kosuke TANAKA , Shun IKENARI
IPC: H01M4/66 , H01M4/13 , H01M10/0525 , H01M10/42
Abstract: A current collector includes a resin layer, a conductive layer, a first intermediate layer that is positioned between the resin layer and the conductive layer and a second intermediate layer that is positioned between the first intermediate layer and the resin layer, the first intermediate layer includes a metal as a main component, and the second intermediate layer includes a metal oxide as a main component.
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4.发明申请公开(公告)号：US20190032219A1
公开(公告)日：2019-01-31
申请号：US16046359
申请日：2018-07-26
Applicant: TDK CORPORATION
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE
IPC: C23C18/16 , C23C18/32 , C23C18/38 , B32B27/08 , B32B27/36 , B32B27/18 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
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Patent Agency Ranking
公开(公告)号：US20250096280A1
公开(公告)日：2025-03-20
申请号：US18729348
申请日：2022-01-17
Applicant: TDK Corporation
Inventor： Mingyu CHEN , Makoto ENDO , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
IPC: H01M4/66 , H01M4/04 , H01M10/0525
Abstract: A current collector including: a resin layer having first and second surfaces on opposites sides; and a metal layer including copper. The metal layer includes a first metal layer located on a side of the first surface of the resin layer. A yield stress σY1 of the current collector is smaller than a tensile fracture stress σB2 of the resin layer. The yield stress σY1 [MPa] is obtained by expressions (1) and (2) from a resin layer yield stress σY2 [MPa], a resin layer thickness D2 [μm], a yield stress σY3 [MPa] of the metal layer, and a thickness D3 [μm] of the metal layer: σ Y 1 = A × σ Y 3 + ( 1 - A ) × σ Y 2 ( 1 ) A = D 3 / ( D 2 + D 3 ) . ( 2 ) The yield stress σY3 [MPa] is obtained by the following expression (3) from a half-value width β [°] of an X-ray diffraction peak having the highest intensity in an X-ray diffraction pattern of the metal layer σ Y 3 = ( - 103 + 1 6 44 × √ β ) . ( 3 )
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公开(公告)号：US20240047696A1
公开(公告)日：2024-02-08
申请号：US18277471
申请日：2021-02-18
Applicant: TDK CORPORATION
Inventor： Makoto ENDO , Mingyu CHEN , Yoshihiro KANBAYASHI , Takasi SATOU , Natsumi KOZAI , Yoshihiko TANABE , Syuji TSUKAMOTO , Miyuki YANAGIDA
Abstract: A laminated resin film includes: a resin layer; and a Cu film having on one surface or both surfaces of the resin layer, in which in the Cu film, an orientation index of a plane is 0.15 or more according to a Lotgering method, a half-width of an X-ray diffraction peak obtained by X-ray diffraction measurement of the plane is 0.3° or less, and Expression (1) is satisfied.
y>3.75x−0.675 Expression (1)
(in Expression (1), Y is the orientation index of the plane in the Cu film according to the Lotgering method, and x is the half-width of the X-ray diffraction peak obtained by the X-ray diffraction measurement of the plane in the Cu film.)-
公开(公告)号：US20230361299A1
公开(公告)日：2023-11-09
申请号：US17634352
申请日：2021-03-29
Applicant: TDK Corporation
Inventor： Takuya AOKI , Shuji HIGASHI , Miyuki YANAGIDA , Makoto ENDO , Yoshihiro KANBAYASHI
IPC: H01M4/583 , H01M4/66 , H01M10/0525
CPC classification number: H01M4/583 , H01M4/667 , H01M10/0525 , G01N23/2055
Abstract: An electrode for power storage devices includes: a resin layer; a conductive layer containing copper and being disposed on the resin layer; and an active material layer containing graphite and being disposed on the conductive layer, wherein when measured by an X-ray diffraction method from a surface of the active material layer, a peak intensity ratio A/B between an intensity A at a highest X-ray diffraction peak in a range where a diffraction angle is 48° or more and 53° or less and an intensity B at a highest X-ray diffraction peak in a range where a diffraction angle is 52° or more and 57° or less satisfies Expression (1):
0.3
≤
A
/
B
≤
1
(1)-
8.发明申请公开(公告)号：US20210087692A1
公开(公告)日：2021-03-25
申请号：US17111040
申请日：2020-12-03
Applicant: TDK CORPORATION
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE
IPC: C23C18/16 , C23C18/32 , C23C18/38 , B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , C23C18/30
Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
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公开(公告)号：US20190032221A1
公开(公告)日：2019-01-31
申请号：US16046422
申请日：2018-07-26
Applicant: TDK CORPORATION , ACHILLES CORPORATION
Inventor： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE , Hiroki ASHIZAWA , Miho MORI , Misaki TAMURA
Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.
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