公开(公告)号：US20190229254A1

公开(公告)日：2019-07-25

申请号：US16233350

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Peter SMEYS ,  Mohammad Hadi MOTIEIAN NAJAR ,  Ting-Ta YEN ,  Ahmad BAHAI

IPC: H01L41/053 ,  H01L27/20 ,  H01L41/09 ,  H01L41/113 ,  H01L41/047 ,  H04R1/40 ,  H04R17/00

Abstract: In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.