公开(公告)号：US20190229254A1

公开(公告)日：2019-07-25

申请号：US16233350

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Peter SMEYS ,  Mohammad Hadi MOTIEIAN NAJAR ,  Ting-Ta YEN ,  Ahmad BAHAI

IPC: H01L41/053 ,  H01L27/20 ,  H01L41/09 ,  H01L41/113 ,  H01L41/047 ,  H04R1/40 ,  H04R17/00

Abstract: In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.

公开(公告)号：US20230245935A1

公开(公告)日：2023-08-03

申请号：US17589405

申请日：2022-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ramlah Binte ABDUL RAZAK ,  Paul Merle EMERSON ,  Mohammad Hadi MOTIEIAN NAJAR

IPC: H01L23/15 ,  H01L23/00

CPC classification number: H01L23/15 ,  H01L24/45 ,  H01L24/05 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/05647 ,  H01L2224/45147 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/73265

Abstract: In some examples, a device comprises a ceramic substrate having a cavity, a die pad in the cavity, and a semiconductor die in the cavity and having a first segment coupled to the die pad and a second segment cantilevered over a floor of the cavity. The device also includes a first conductive member in the cavity, the first conductive member coupled to a second conductive member exposed to an exterior of the ceramic substrate. The device also includes a bond wire coupled to a device side of the semiconductor die and to the first conductive member.