公开(公告)号：US20240146309A1

公开(公告)日：2024-05-02

申请号：US18050451

申请日：2022-10-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Ali DJABBARI ,  Peter SMEYS

IPC: H03L1/02 ,  H03B5/04

CPC classification number: H03L1/027 ,  H03B5/04 ,  H03L7/099

Abstract: A circuit includes: a first resonator; a temperature compensation circuit including a resonator group-delay analyzer and a second resonator; oscillator control circuitry; and a controller. The resonator group-delay analyzer is configured to determine a group-delay parameter responsive to operations of the second resonator. The controller is configured to provide a control signal responsive to the group-delay parameter. The oscillator control circuitry is configured to adjust a frequency of an output signal of the oscillator control circuitry responsive to the control signal.

公开(公告)号：US20230100911A1

公开(公告)日：2023-03-30

申请号：US17488586

申请日：2021-09-29

Applicant: Texas Instruments Incorporated

Inventor： Peter SMEYS ,  Ting-Ta YEN

IPC: H01L21/78 ,  B81B7/00 ,  B81C3/00 ,  H01L23/00 ,  H01L23/544

Abstract: An encapsulation chip manufacturing method includes forming first and second dicing grooves in a surface of a cap wafer and aligning the cap wafer and a device substrate such that the surface of the cap wafer faces a surface of the device substrate. The device substrate includes a device affixed to the surface and a bond pad on the surface and coupled to the device. The cap wafer is bonded to the device substrate and partially diced at the first and second dicing grooves such that the bond pad is exposed. Aligning the cap wafer and the device substrate includes aligning the first and second dicing grooves between the bond pad and a bonding area at which the cap wafer is bonded to the device substrate. A width of the first and second dicing grooves prevents cap wafer dust formed during the partial dicing from falling on the bond pad.

公开(公告)号：US20190229254A1

公开(公告)日：2019-07-25

申请号：US16233350

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Peter SMEYS ,  Mohammad Hadi MOTIEIAN NAJAR ,  Ting-Ta YEN ,  Ahmad BAHAI

IPC: H01L41/053 ,  H01L27/20 ,  H01L41/09 ,  H01L41/113 ,  H01L41/047 ,  H04R1/40 ,  H04R17/00

Abstract: In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.

公开(公告)号：US20190030569A1

公开(公告)日：2019-01-31

申请号：US15664637

申请日：2017-07-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mohammad Hadi Motieian NAJAR ,  Peter SMEYS

IPC: B06B1/06 ,  A61B8/00 ,  H01L41/047 ,  B06B1/02

CPC classification number: B06B1/0618 ,  A61B8/4483 ,  B06B1/0292 ,  H01L41/047

Abstract: A hybrid micromachined ultrasound transducer includes a piezoelectric micromachined transducer and a capacitive micromachined transducer. The capacitive micromachined transducer is vertically stacked with the piezoelectric micromachined transducer. The piezoelectric micromachined transducer and the capacitive micromachined transducer include a common shared electrode.

公开(公告)号：US20200186120A1

公开(公告)日：2020-06-11

申请号：US16509224

申请日：2019-07-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA FERNANDEZ ,  Peter SMEYS

IPC: H03H9/02 ,  H03H9/25 ,  H03H9/145 ,  H01L41/053 ,  G01L3/10

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

公开(公告)号：US20190206741A1

公开(公告)日：2019-07-04

申请号：US15858862

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anindya PODDAR ,  Usman Mahmood CHAUDHRY ,  Tran Kiet THU ,  Mahmud Halim CHOWDHURY ,  Peter SMEYS

IPC: H01L21/8234 ,  H01L21/762 ,  H01L21/304 ,  H01L27/088 ,  H01L23/31

CPC classification number: H01L21/823481 ,  H01L21/3043 ,  H01L21/76224 ,  H01L21/823425 ,  H01L21/823487 ,  H01L23/3178 ,  H01L27/088

Abstract: In one aspect of the disclosure, an integrated circuit is disclosed. The integrated circuit includes a first FET device formed on a substrate having a first source, a first gate, and a first channel. The first channel is formed in the substrate, connecting the first source to a common drain. The integrated circuit also includes a second FET device formed on the substrate having a second source, a second gate, and a second channel. The second channel is formed in the substrate, connecting the second source to the common drain. A trench is formed in the substrate between the first channel and the second channel.

公开(公告)号：US20200212880A1

公开(公告)日：2020-07-02

申请号：US16236601

申请日：2018-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA FERNANDEZ ,  Peter SMEYS ,  Ting-Ta YEN

IPC: H03H9/17 ,  H03H3/02 ,  H03H9/13 ,  C23C14/35 ,  C23C16/455

Abstract: A resonator includes a substrate, an acoustic Bragg mirror disposed above the substrate, and a bottom metal layer disposed above the acoustic Bragg mirror. The resonator also includes a piezoelectric plate disposed above the bottom metal layer. The resonator further includes a top metal layer disposed above the piezoelectric plate. The top metal layer comprises multiple fingers within a single plane and the width of each of the fingers is between 75%-125% of a thickness of the piezoelectric plate.