公开(公告)号：US11756882B2

公开(公告)日：2023-09-12

申请号：US17138906

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Alejandro Hernandez-Luna

IPC: H01L23/525 ,  H01L23/528 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/5256 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/5283

Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, and a multilayer dielectric between the sacrificial fuse element and the semiconductor substrate, the multilayer dielectric forming one or more planar gaps beneath a profile of the sacrificial fuse element.

公开(公告)号：US20220208676A1

公开(公告)日：2022-06-30

申请号：US17138906

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Alejandro Hernandez-Luna

IPC: H01L23/525 ,  H01L23/528 ,  H01L23/48 ,  H01L23/495 ,  H01L23/31

Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, and a multilayer dielectric between the sacrificial fuse element and the semiconductor substrate, the multilayer dielectric forming one or more planar gaps beneath a profile of the sacrificial fuse element.

公开(公告)号：US11322433B2

公开(公告)日：2022-05-03

申请号：US16842567

申请日：2020-04-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Alejandro Hernandez-Luna

IPC: H01L23/31 ,  H01L23/498 ,  H01L43/06

Abstract: In some examples, a package comprises first and second terminals and a conductive pathway coupling the first and second terminals. The conductive pathway is configured to generate a magnetic field. The package comprises a conductive member aligned with and coupled to the conductive pathway. The conductive pathway and the conductive member have a common shape. The package also comprises an insulative layer coupled to the conductive member and a die coupled to the insulative layer and having a circuit configured to measure the magnetic field. The circuit faces the conductive pathway.