公开(公告)号：US11201065B2

公开(公告)日：2021-12-14

申请号：US16791152

申请日：2020-02-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Byron Harry Gibbs

IPC: H01L21/56 ,  H01L21/687

Abstract: A method of manufacturing a semiconductor package includes covering a semiconductor die and a plurality of conductive terminals coupled to the semiconductor die in a mold compound, positioning the mold compound between a first pair of electrodes and a second pair of electrodes, and moving a movable electrode of the first pair and a movable electrode of the second pair into a first clamping position. In the first clamping position, each of the first pair of electrodes and the second pair of electrodes electrically couples to a unique subset of the plurality of conductive terminals. The method also includes applying, by the first pair of electrodes, a first voltage to the semiconductor die within the mold compound; and applying, by the second pair of electrodes, a second voltage to the semiconductor die within the mold compound. The second voltage is less than the first voltage.

公开(公告)号：US20220208571A1

公开(公告)日：2022-06-30

申请号：US17139072

申请日：2020-12-31

Applicant: Texas Instruments Incorporated

Inventor： Byron Harry Gibbs ,  Michael Todd Wyant

IPC: H01L21/67 ,  H01L21/78 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: In a described example, an apparatus includes: a process chamber configured for a pressure greater than one atmosphere, having a device chuck configured to support electronic devices that are mounted on package substrates and partially covered in mold compound, the electronic devices spaced from one another by saw streets; and a saw in the process chamber configured to cut through the mold compound and package substrates in the saw streets to separate the molded electronic devices one from another.

公开(公告)号：US11676829B2

公开(公告)日：2023-06-13

申请号：US17139072

申请日：2020-12-31

Applicant: Texas Instruments Incorporated

Inventor： Byron Harry Gibbs ,  Michael Todd Wyant

IPC: H01L21/67 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L21/67092 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/78 ,  H01L23/562 ,  H01L2223/5446

Abstract: In a described example, an apparatus includes: a process chamber configured for a pressure greater than one atmosphere, having a device chuck configured to support electronic devices that are mounted on package substrates and partially covered in mold compound, the electronic devices spaced from one another by saw streets; and a saw in the process chamber configured to cut through the mold compound and package substrates in the saw streets to separate the molded electronic devices one from another.