公开(公告)号：US20240145454A1

公开(公告)日：2024-05-02

申请号：US17977810

申请日：2022-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： DAIKI KOMATSU

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L31/173

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L25/0753 ,  H01L31/173 ,  H01L2924/1204

Abstract: An electronic device includes a substrate and a die having an active surface where the die is disposed on the substrate. A sensor is disposed on the active surface of the die such that the sensor is exposed to an external environment. Electrical interconnects are disposed on the active surface of the die near a perimeter of the die. Conductive terminals have a first end attached to a contact surface of the electrical interconnects and a second end that attaches to an external terminal.

公开(公告)号：US20240178104A1

公开(公告)日：2024-05-30

申请号：US18070530

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： MAKOTO SHIBUYA ,  DAIKI KOMATSU ,  MASAMITSU MATSUURA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3107 ,  H01L28/10

Abstract: An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.