公开(公告)号：US20190013288A1

公开(公告)日：2019-01-10

申请号：US16028741

申请日：2018-07-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： WOOCHAN KIM ,  MASAMITSU MATSUURA ,  MUTSUMI MASUMOTO ,  KENGO AOYA ,  HAU THANH NGUYEN ,  VIVEK KISHORECHAND ARORA ,  ANINDYA PODDAR

IPC: H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L23/532 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/29 ,  H01L23/528

Abstract: An embedded die package includes a first die having an operating voltage between a first voltage potential and a second voltage potential that is less than the first voltage potential. A via, including a conductive material, is electrically connected to a bond pad on a surface of the first die, the via including at least one extension perpendicular to a plane along a length of the via. A redistribution layer (RDL) is electrically connected to the via, at an angle with respect to the via defining a space between the surface and a surface of the RDL. A build-up material is in the space.

公开(公告)号：US20240178104A1

公开(公告)日：2024-05-30

申请号：US18070530

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： MAKOTO SHIBUYA ,  DAIKI KOMATSU ,  MASAMITSU MATSUURA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3107 ,  H01L28/10

Abstract: An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.