公开(公告)号：US11735506B2

公开(公告)日：2023-08-22

申请号：US16206640

申请日：2018-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu Chou ,  Bo-Hsun Pan ,  Yuh-Harng Chien ,  Fu-Hua Yu ,  Steven Alfred Kummerl ,  Jie Chen ,  Rajen M. Murugan

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/4821 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US11742265B2

公开(公告)日：2023-08-29

申请号：US16660713

申请日：2019-10-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu Chou ,  Chi-Chen Chien ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Fu-Hua Yu

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/49548 ,  H01L23/49861 ,  H01L23/5228

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.