公开(公告)号：US12211800B2

公开(公告)日：2025-01-28

申请号：US17500086

申请日：2021-10-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi Tang ,  Rajen Manicon Murugan ,  Liang Wan ,  Makarand Ramkrishna Kulkarni ,  Jie Chen ,  Steven Alfred Kummerl

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package includes a first layer including a semiconductor die and a shunt embedded within a first dielectric substrate layer, and metal pillars extending therethrough. The semiconductor package further includes a second layer stacked on the first layer, the second layer including a metal trace patterned on the first dielectric substrate layer, and a second dielectric substrate layer over the metal trace. The metal trace electrically connects a first portion of the shunt to a first metal pillar of the metal pillars and electrically connects a second portion of the shunt to a second metal pillar of the metal pillars. The semiconductor package further includes a base layer opposite the second layer relative the first layer, the base layer forming exposed electrical contact pads for the semiconductor package, the electrical contact pads providing electrical connections to the shunt, the metal pillars, and the semiconductor die.

公开(公告)号：US20230207410A1

公开(公告)日：2023-06-29

申请号：US17562666

申请日：2021-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steven Alfred Kummerl

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/31 ,  H01L24/06 ,  H01L21/565

Abstract: An electronic device includes a semiconductor die, a bond wire coupled to a side of the semiconductor die, and a package structure that encloses the semiconductor die and the bond wire. The package structure has a package side with a recess that extends inward from the package side toward the side of the semiconductor die. The recess has a bottom that is spaced apart from the side of the semiconductor die, and the bottom is spaced apart from the bond wire.

公开(公告)号：US11296016B2

公开(公告)日：2022-04-05

申请号：US15808537

申请日：2017-11-09

Applicant: Texas Instruments Incorporated

Inventor： Robert Allan Neidorff ,  Benjamin Cook ,  Steven Alfred Kummerl ,  Barry Jon Male ,  Peter Smeys

IPC: H01L23/495 ,  H01L23/485 ,  H01L23/31 ,  B81C1/00

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

公开(公告)号：US20210050459A1

公开(公告)日：2021-02-18

申请号：US16539442

申请日：2019-08-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steven Alfred Kummerl ,  Simon Joshua Jacobs ,  James Richard Huckabee ,  Jo Bito ,  Rongwei Zhang

IPC: H01L31/0216 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/00 ,  H01L31/024 ,  G02B5/20

Abstract: An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.

公开(公告)号：US10553573B2

公开(公告)日：2020-02-04

申请号：US15693985

申请日：2017-09-01

Applicant: Texas Instruments Incorporated

Inventor： Daniel Lee Revier ,  Steven Alfred Kummerl ,  Benjamin Stassen Cook

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01F7/02 ,  H01F7/20 ,  H01L25/00 ,  H01L21/687

Abstract: Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.

公开(公告)号：US09646906B2

公开(公告)日：2017-05-09

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Django Trombley ,  Steven Alfred Kummerl ,  Paul Emerson

IPC: H01L21/288 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H05K1/09 ,  H05K1/16 ,  H01L23/495

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

公开(公告)号：US09496171B2

公开(公告)日：2016-11-15

申请号：US14848941

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Matthew David Romig ,  Steven Alfred Kummerl ,  Wei-Yan Shih

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。

公开(公告)号：US20220415762A1

公开(公告)日：2022-12-29

申请号：US17359635

申请日：2021-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel Manack ,  Jonathan Andrew Montoya ,  Steven Alfred Kummerl ,  Salvatore Frank Pavone

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/60 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor die including terminals, a plurality of leads, at least some of the leads being electrically coupled to the terminals within the semiconductor package, a sensor on a surface of the semiconductor die, laser shielding forming a perimeter around the sensor on the surface of the semiconductor die, and a mold compound surrounding the semiconductor die except for an area inside the perimeter on the surface of the semiconductor die such that the sensor is exposed to an external environment.

公开(公告)号：US11270937B2

公开(公告)日：2022-03-08

申请号：US16232684

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Steven Alfred Kummerl ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L21/56 ,  H01L49/02

Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

公开(公告)号：US20210043548A1

公开(公告)日：2021-02-11

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.