公开(公告)号：US20210175165A1

公开(公告)日：2021-06-10

申请号：US16827455

申请日：2020-03-23

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： MAKOTO SHIBUYA ,  KENGO AOYA ,  WOOCHAN KIM ,  VIVEK KISHORECHAND ARORA

IPC: H01L23/498 ,  H01L23/64 ,  H01L49/02 ,  H01L23/00 ,  H01L21/8234 ,  H01L21/48

Abstract: An integrated circuit (IC) package includes a substrate having a first region and a second region. The substrate includes a conductive path between the first region and the second region. The IC package also includes a lead frame having a first member and a second member that are spaced apart. The IC package further includes a half-bridge power module. The half-bridge power module includes a capacitor having a first node coupled to the first member of the lead frame and a second node coupled to the second member of the lead frame. The half-bridge power module also includes a high side die having a high side field effect transistor (FET) embedded therein and a low side die having a low side FET embedded therein. A source of the high side FET is coupled to a drain of the low side FET through the conductive path of the substrate.

公开(公告)号：US20240178104A1

公开(公告)日：2024-05-30

申请号：US18070530

申请日：2022-11-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： MAKOTO SHIBUYA ,  DAIKI KOMATSU ,  MASAMITSU MATSUURA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3107 ,  H01L28/10

Abstract: An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.