公开(公告)号：US20190385899A1

公开(公告)日：2019-12-19

申请号：US16550834

申请日：2019-08-26

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien HO

IPC: H01L21/762 ,  H01L23/00 ,  H05K3/38 ,  H01L21/306

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US10395971B2

公开(公告)日：2019-08-27

申请号：US15852532

申请日：2017-12-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien Ho

IPC: H01L23/02 ,  H01L21/762 ,  H01L23/00 ,  H01L21/306 ,  H05K3/38

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US20250096034A1

公开(公告)日：2025-03-20

申请号：US18968954

申请日：2024-12-04

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien HO

IPC: H01L21/762 ,  H01L21/306 ,  H01L23/00 ,  H01L23/495 ,  H05K3/38

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US20230317571A1

公开(公告)日：2023-10-05

申请号：US17708038

申请日：2022-03-30

Applicant: Texas Instruments Incorporated

Inventor： Hsiang Ming Hsiao ,  Hung-Yu Chou ,  Yuh-Harng Chien ,  Chih-Chien Ho ,  Che Wei Tu ,  Bo-Hsun Pan ,  Megan Chang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49555 ,  H01L21/56 ,  H01L21/4821 ,  H01L23/3107

Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.