公开(公告)号：US20250096034A1

公开(公告)日：2025-03-20

申请号：US18968954

申请日：2024-12-04

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien HO

IPC: H01L21/762 ,  H01L21/306 ,  H01L23/00 ,  H01L23/495 ,  H05K3/38

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US10395971B2

公开(公告)日：2019-08-27

申请号：US15852532

申请日：2017-12-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien Ho

IPC: H01L23/02 ,  H01L21/762 ,  H01L23/00 ,  H01L21/306 ,  H05K3/38

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US20190385899A1

公开(公告)日：2019-12-19

申请号：US16550834

申请日：2019-08-26

Applicant: Texas Instruments Incorporated

Inventor： Chang-Yen Ko ,  Chung-Ming Cheng ,  Megan Chang ,  Chih-Chien HO

IPC: H01L21/762 ,  H01L23/00 ,  H05K3/38 ,  H01L21/306

Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

公开(公告)号：US10957631B2

公开(公告)日：2021-03-23

申请号：US16218102

申请日：2018-12-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Ming Cheng ,  Yuh-Harng Chien ,  Fu-Kang Lee ,  Chia-Yu Chang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L21/48

Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.