公开(公告)号：US20200075573A1

公开(公告)日：2020-03-05

申请号：US16547615

申请日：2019-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.

公开(公告)号：US11101263B2

公开(公告)日：2021-08-24

申请号：US16547615

申请日：2019-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525 ,  H01L27/08 ,  H01L49/02

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.

公开(公告)号：US11525739B2

公开(公告)日：2022-12-13

申请号：US15973964

申请日：2018-05-08

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Steven Aldred Kummerl ,  Steve Edward Harrell

IPC: H01C7/10 ,  G01K1/08 ,  H01C7/00 ,  G01K7/24 ,  H01C1/01 ,  H01C1/034 ,  H01C17/00

Abstract: A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

公开(公告)号：US20210343694A1

公开(公告)日：2021-11-04

申请号：US17376747

申请日：2021-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525 ,  H01L27/08

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.