公开(公告)号：US20250079401A1

公开(公告)日：2025-03-06

申请号：US18459075

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei ZHANG ,  Thomas KRONENBERG ,  Jie CHEN

IPC: H01L25/065 ,  H01L21/3065 ,  H01L21/56 ,  H01L21/822 ,  H01L23/00 ,  H01L23/31 ,  H01L23/60

Abstract: In examples, a package comprises first and second dies including first and second diodes, respectively. The package comprises first and second metal contacts coupled to bottom surfaces of the first and second dies, respectively, with the first and second metal contacts exposed to a bottom surface of the package. The package also comprises an isolation layer between the first and second dies and between the first and second metal contacts and a metal layer coupled to top surfaces of the first and second dies. The package also comprises a mold compound covering the first and second dies and the metal layer.

公开(公告)号：US20250140620A1

公开(公告)日：2025-05-01

申请号：US18498679

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas KRONENBERG ,  Mohammad WASEEM HUSSAIN

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00

Abstract: In examples, a method for manufacturing a package comprises depositing a metal contact layer on a surface of a wafer, the wafer including first and second diodes; positioning the wafer on an expandable tape coupled to a carrier; dicing the wafer to produce first and second dies, the first die including the first diode and the second die including the second diode; wire bonding the first die to the second die using a bond wire; covering the first and second dies and the bond wire with a mold compound to produce a molded structure; decoupling the molded structure from the expandable tape; and sawing the molded structure to produce the package.