公开(公告)号：US20210020549A1

公开(公告)日：2021-01-21

申请号：US16511313

申请日：2019-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jason CHIEN ,  Yuh-Harng CHIEN ,  J K HO

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package includes a first lead with first and second ends extending in the same direction as one another. At least one second lead has first and second ends and is partially surrounded by the first lead. A die pad is provided and a die is connected to the die pad. Wires electrically connect the die to the first lead and the at least one second lead. An insulating layer extends over the leads, the die pad, and the die such that the first end of the at least one second lead is exposed from the semiconductor package and the second end of the first lead is encapsulated entirely within the insulating layer.

公开(公告)号：US20230063262A1

公开(公告)日：2023-03-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao LIN ,  Hung-Yu CHOU ,  Bo-Hsun PAN ,  Dong-Ren PENG ,  Pi-Chiang HUANG ,  Yuh-Harng CHIEN

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

公开(公告)号：US20190206769A1

公开(公告)日：2019-07-04

申请号：US15856346

申请日：2017-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L25/065

CPC classification number: H01L23/49544 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/544 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/85122 ,  H01L2224/85201 ,  H01L2924/35 ,  H01L2924/37001 ,  H01L2924/386

Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

公开(公告)号：US20210375640A1

公开(公告)日：2021-12-02

申请号：US17401057

申请日：2021-08-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/62 ,  H01L23/00

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20210118779A1

公开(公告)日：2021-04-22

申请号：US16660713

申请日：2019-10-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Chi-Chen CHIEN ,  Yuh-Harng CHIEN ,  Steven Alfred KUMMERL ,  Bo-Hsun PAN ,  Fu-Hua YU

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/522

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.

公开(公告)号：US20230395472A1

公开(公告)日：2023-12-07

申请号：US18453999

申请日：2023-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/565 ,  H01L21/4821 ,  H01L23/49503 ,  H01L23/3107

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to th first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US20190355652A1

公开(公告)日：2019-11-21

申请号：US16206640

申请日：2018-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US20190326131A1

公开(公告)日：2019-10-24

申请号：US16459184

申请日：2019-07-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20190206699A1

公开(公告)日：2019-07-04

申请号：US15857988

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L23/49517 ,  H01L23/49548

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.