公开(公告)号：US20240365576A1

公开(公告)日：2024-10-31

申请号：US18768915

申请日：2024-07-10

Applicant: TOPPAN INC.

Inventor： Akiharu MIYANAGA ,  Tetsuji ITO ,  Mayuko WATANABE

IPC: H10K50/115 ,  H01L27/12 ,  H01L29/24 ,  H01L29/786 ,  H10K59/121 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K50/115 ,  H10K59/1213 ,  H10K77/111 ,  H01L27/1225 ,  H01L29/24 ,  H01L29/7869 ,  H10K2102/3026 ,  H10K2102/311

Abstract: Provided is a display device containing quantum dots. A display device includes a display area. The display area has a light emitting device in which a first electrode, a layer between the first electrode and an emitting layer, the emitting layer, a layer between the emitting layer and a second electrode, and the second electrode are stacked in this order on a substrate. The emitting layer is formed of an inorganic layer containing quantum dots, and the light emitting device is a top emission device. A thin film transistor connected to the light emitting device is preferably an n-ch TFT.

公开(公告)号：US20250083421A1

公开(公告)日：2025-03-13

申请号：US18960916

申请日：2024-11-26

Applicant: TOPPAN INC.

Inventor： Kazuyuki YAMASHITA ,  Eiichi KANAUMI ,  Akiharu MIYANAGA

IPC: B32B27/00 ,  C09K11/02 ,  H01L33/50

Abstract: A method for manufacturing a resin molded product is provided. The resin molded product is obtained by molding a resin composition in which quantum dots are dispersed. The method includes stirring resin and metal soap to form a resin mixture, obtaining a quantum dot liquid by dispersing the quantum dots in a solvent, obtaining the resin composition in a solid state by kneading the quantum dot liquid in the resin mixture, and forming a sheet-like shaped resin molded product by extrusion molding the resin composition in the solid state.