公开(公告)号：US20230125635A1

公开(公告)日：2023-04-27

申请号：US17954456

申请日：2022-09-28

Applicant: TORAY ADVANCED MATERIALS KOREA INC.

Inventor： Jong Yong Park ,  Ha Soo Lee ,  Jong Hun Cheon

IPC: C23C28/02 ,  C08J5/12 ,  H01Q1/38 ,  C23C14/20 ,  C23C14/02 ,  C25D3/38 ,  C25D5/56

Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.

公开(公告)号：US20230199947A1

公开(公告)日：2023-06-22

申请号：US18080897

申请日：2022-12-14

Applicant: TORAY ADVANCED MATERIALS KOREA INC.

Inventor： Jong Hun Cheon ,  Ha Soo Lee ,  Jong Yong Park

IPC: H05K1/03 ,  H05K3/38 ,  H05K3/02 ,  H05K1/09

CPC classification number: H05K1/0393 ,  H05K3/384 ,  H05K3/025 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2201/0154

Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.