公开(公告)号：US20160141159A1

公开(公告)日：2016-05-19

申请号：US14979768

申请日：2015-12-28

Applicant: TOSOH CORPORATION

Inventor： Shigehisa TODOKO ,  Kimiaki TAMANO ,  Kenichi ITOH ,  Tetsuo SHIBUTAMI

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/08

CPC classification number: H01J37/3491 ,  C23C14/081 ,  C23C14/086 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3426

Abstract: Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule.By filling a molten bonding material in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling, a cylindrical ceramic sputtering target is manufactured so as to be characterized in that as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less.

Abstract translation: 提供了一种圆柱形陶瓷溅射靶，其显着减少了裂纹，芯片，异常放电和结节的发生。 通过将熔融接合材料填充在由圆柱形陶瓷靶材料和圆柱形基材限定的空腔中，依次从圆柱形轴向从其一端朝向另一端开始冷却熔融粘合材料，并进一步填充熔融粘合 在冷却期间的空腔中的材料，制造圆柱形陶瓷溅射靶，其特征在于，通过接合材料的X射线照片观察，不存在接合材料的部分的总面积为10cm 2以下 50cm 2的X射线摄影区域，不存在接合材料的部分的最大面积为9cm 2以下。