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公开(公告)号:US20250004383A1
公开(公告)日:2025-01-02
申请号:US18346113
申请日:2023-06-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kenji YAMAZOE , Chih-Shiang CHOU
IPC: G03F7/00 , G03F1/70 , H01L21/033
Abstract: A process for forming a photolithography mask includes generating a sub-resolution assist feature (SRAF) pattern from a blank mask layout based on a target layout. The SRAF pattern can be generated using an iterative process including finding the gradient of a cost function. A main pattern can be generated simultaneously with the SRAF pattern or after generation of the SRAF pattern.