公开(公告)号：US12191185B2

公开(公告)日：2025-01-07

申请号：US17883589

申请日：2022-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Chin-Lin Chou ,  Shang-Ying Tsai ,  Shou-Wen Kuo ,  Kuei-Sung Chang ,  Jiun-Rong Pai ,  Hsu-Shui Liu ,  Chun-Wen Cheng

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

公开(公告)号：US11508608B2

公开(公告)日：2022-11-22

申请号：US16998461

申请日：2020-08-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Chin-Lin Chou ,  Shang-Ying Tsai ,  Shou-Wen Kuo ,  Kuei-Sung Chang ,  Jiun-Rong Pai ,  Hsu-Shui Liu ,  Chun-wen Cheng

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.