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    EFEM robot auto teaching methodology
    2.
    发明授权
    EFEM robot auto teaching methodology 有权

    公开(公告)号：US10861723B2

    公开(公告)日：2020-12-08

    申请号：US15822865

    申请日：2017-11-27

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

    IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

    Abstract: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.

    Vacuum wafer chuck for manufacturing semiconductor devices
    3.
    发明授权
    Vacuum wafer chuck for manufacturing semiconductor devices 有权

    公开(公告)号：US12191185B2

    公开(公告)日：2025-01-07

    申请号：US17883589

    申请日：2022-08-08

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Fa Lee ,  Chin-Lin Chou ,  Shang-Ying Tsai ,  Shou-Wen Kuo ,  Kuei-Sung Chang ,  Jiun-Rong Pai ,  Hsu-Shui Liu ,  Chun-Wen Cheng

    IPC: H01L21/683 ,  B25B11/00

    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

    EFEM ROBOT AUTO TEACHING METHODOLOGY
    6.
    发明申请
    EFEM ROBOT AUTO TEACHING METHODOLOGY 审中-公开

    公开(公告)号：US20190051546A1

    公开(公告)日：2019-02-14

    申请号：US15822865

    申请日：2017-11-27

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

    IPC: H01L21/67 ,  H01L21/677

    Abstract: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.

    Integrated chip die carrier exchanger
    8.
    发明授权
    Integrated chip die carrier exchanger 有权

    公开(公告)号：US11545382B2

    公开(公告)日：2023-01-03

    申请号：US16853846

    申请日：2020-04-21

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

    IPC: B08B3/04 ,  H01L21/677 ,  B08B3/08

    Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.

    Integrated chip die carrier exchanger
    10.
    发明授权
    Integrated chip die carrier exchanger 有权

    公开(公告)号：US10665489B2

    公开(公告)日：2020-05-26

    申请号：US15249801

    申请日：2016-08-29

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

    IPC: H01L21/67 ,  H01L21/677 ,  B08B3/04 ,  B08B3/08

    Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

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