公开(公告)号：US11004720B2

公开(公告)日：2021-05-11

申请号：US15987581

申请日：2018-05-23

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Chen ,  Meng-Chen Lin ,  Chung-Hsin Chien ,  Hsuan Lee ,  Boris Huang

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

摘要： A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

公开(公告)号：US20190051546A1

公开(公告)日：2019-02-14

申请号：US15822865

申请日：2017-11-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC分类号： H01L21/67 ,  H01L21/677

摘要： The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.

公开(公告)号：US20230386887A1

公开(公告)日：2023-11-30

申请号：US18231751

申请日：2023-08-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M.C. Lin ,  C.C. Chien ,  Hsuan Lee ,  Boris Huang

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L22/34 ,  H01L21/02043 ,  H01L2221/68327

摘要： A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

公开(公告)号：US10861723B2

公开(公告)日：2020-12-08

申请号：US15822865

申请日：2017-11-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

摘要： The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.

公开(公告)号：US11984331B2

公开(公告)日：2024-05-14

申请号：US17082213

申请日：2020-10-28

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

CPC分类号： H01L21/67201 ,  H01L21/67259 ,  H01L21/67766 ,  H01L21/67775 ,  H01L21/681 ,  H01L21/68707

摘要： The present disclosure relates to an equipment front end module (EFEM) teaching element. The EFEM teaching element includes a memory element configured to store data describing an initial position of an EFEM robot within an EFEM chamber. A position measurement device is configured to take measurements describing a new position of the EFEM robot within the EFEM chamber that is different than the initial position of the EFEM robot. A controller is configured to determine a set of new movement commands describing a path of the EFEM robot based upon the data describing the initial position of the EFEM robot and the measurements.

公开(公告)号：US11545382B2

公开(公告)日：2023-01-03

申请号：US16853846

申请日：2020-04-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC分类号： B08B3/04 ,  H01L21/677 ,  B08B3/08

摘要： The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.

公开(公告)号：US11171065B2

公开(公告)日：2021-11-09

申请号：US16600789

申请日：2019-10-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC分类号： H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US10665489B2

公开(公告)日：2020-05-26

申请号：US15249801

申请日：2016-08-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC分类号： H01L21/67 ,  H01L21/677 ,  B08B3/04 ,  B08B3/08

摘要： The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

公开(公告)号：US20170372932A1

公开(公告)日：2017-12-28

申请号：US15249801

申请日：2016-08-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC分类号： H01L21/677 ,  B08B3/08 ,  B08B3/04

摘要： The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

公开(公告)号：US20210043481A1

公开(公告)日：2021-02-11

申请号：US17082213

申请日：2020-10-28

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

摘要： The present disclosure relates to an equipment front end module (EFEM) teaching element. The EFEM teaching element includes a memory element configured to store data describing an initial position of an EFEM robot within an EFEM chamber. A position measurement device is configured to take measurements describing a new position of the EFEM robot within the EFEM chamber that is different than the initial position of the EFEM robot. A controller is configured to determine a set of new movement commands describing a path of the EFEM robot based upon the data describing the initial position of the EFEM robot and the measurements.