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公开(公告)号:US11929271B2
公开(公告)日:2024-03-12
申请号:US16927089
申请日:2020-07-13
IPC分类号: H01L21/67 , G01M3/38 , H01L21/677
CPC分类号: H01L21/67265 , G01M3/38 , H01L21/67259 , H01L21/67288 , H01L21/67772
摘要: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
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公开(公告)号:US20220375057A1
公开(公告)日:2022-11-24
申请号:US17881338
申请日:2022-08-04
发明人: Chien-Ko Liao , Ya-Hsun Hsueh , Sheng-Hsiang Chuang , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
摘要: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.
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公开(公告)号:US11004720B2
公开(公告)日:2021-05-11
申请号:US15987581
申请日:2018-05-23
发明人: Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo , Jian-Hung Chen , Meng-Chen Lin , Chung-Hsin Chien , Hsuan Lee , Boris Huang
IPC分类号: H01L21/683 , H01L21/304 , H01L21/66 , H01L21/02
摘要: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.
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4.
公开(公告)号:US20190163149A1
公开(公告)日:2019-05-30
申请号:US16028422
申请日:2018-07-06
发明人: Sing-Tsung Li , Hsu-Shui Liu , Jiun-Rong Pai , Sheng-Hsiang Chuang , Shou-Wen Kuo , Chien-Ko Liao
IPC分类号: G05B19/042 , G06T7/00
摘要: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.
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公开(公告)号:US20190103314A1
公开(公告)日:2019-04-04
申请号:US15903815
申请日:2018-02-23
发明人: Tsung-Sheng Kuo , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo , Yang-Ann Chu
摘要: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
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公开(公告)号:US20190051546A1
公开(公告)日:2019-02-14
申请号:US15822865
申请日:2017-11-27
发明人: Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
IPC分类号: H01L21/67 , H01L21/677
摘要: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.
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公开(公告)号:US20230386887A1
公开(公告)日:2023-11-30
申请号:US18231751
申请日:2023-08-08
发明人: Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo , Jian-Hung Cheng , M.C. Lin , C.C. Chien , Hsuan Lee , Boris Huang
IPC分类号: H01L21/683 , H01L21/304 , H01L21/66 , H01L21/02
CPC分类号: H01L21/6836 , H01L21/304 , H01L22/34 , H01L21/02043 , H01L2221/68327
摘要: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.
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8.
公开(公告)号:US11414757B2
公开(公告)日:2022-08-16
申请号:US16172835
申请日:2018-10-28
发明人: Yi-Shiung Chen , Cheng-Yi Huang , Chih-Shen Yang , Shou-Wen Kuo , Po-Wen Chai
IPC分类号: C23C16/455 , C23C16/52 , H01L21/67
摘要: A gas tube, a gas supply system containing the same and a semiconductor manufacturing method using the same are provided. The gas tube includes a porous material body and a resistant sheath surrounding the porous material body. The porous material body has a hollow tube structure and an empty cavity inside the hollow tube structure. The porous material body is hydrophobic and has a plurality of pores therein. The resistant sheath is disposed on the porous material body and surrounds the porous material body. The resistant sheath includes a plurality of holes penetrating through the resistant sheath.
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公开(公告)号:US10861723B2
公开(公告)日:2020-12-08
申请号:US15822865
申请日:2017-11-27
发明人: Chien-Fa Lee , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
IPC分类号: H01L21/67 , H01L21/677 , H01L21/68 , H01L21/687
摘要: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.
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公开(公告)号:US10714364B2
公开(公告)日:2020-07-14
申请号:US15965701
申请日:2018-04-27
IPC分类号: G01M3/38 , H01L21/67 , H01L21/677
摘要: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load port outside the housing; a robot arm inside the housing; and a processor. The load port is coupled to the wall and configured to load a wafer carrier for inspection. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
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