公开(公告)号：US12216407B2

公开(公告)日：2025-02-04

申请号：US18114690

申请日：2023-02-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Hsuan Chuang ,  Po-Sheng Lu ,  Shou-Wen Kuo ,  Cheng-Yi Huang ,  Chia-Hung Chu

IPC: G03F7/16 ,  G03F7/004 ,  H01L21/027

Abstract: A multi-spray RRC process with dynamic control to improve final yield and further reduce resist cost is disclosed. In one embodiment, a method, includes: dispensing a first layer of solvent on a semiconductor substrate while spinning at a first speed for a first time period; dispensing the solvent on the semiconductor substrate while spinning at a second speed for a second time period so as to transform the first layer to a second layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a third speed for a third time period so as to transform the second layer to a third layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a fourth speed for a fourth time period so as to transform the third layer to a fourth layer of the solvent; and dispensing a first layer of photoresist on the fourth layer of the solvent while spinning at a fifth speed for a fifth period of time.

公开(公告)号：US10649336B2

公开(公告)日：2020-05-12

申请号：US14871846

申请日：2015-09-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Jun-Yih Yu ,  Chang-Fa Lin ,  Ching-Hung Cheng ,  Yi-Chuan Lo ,  Ming-Hsuan Chuang

IPC: G03F7/30 ,  G03F7/32 ,  H01L27/11582 ,  H01L49/02

Abstract: A system for fabricating a semiconductor device includes a first supplier, a second supplier, a mixer, and an applier. The first supplier is configured to supply a developer solution having a first chemical. The second supplier is configured to supply the second chemical to the mixer. The mixer is configured to mix the developer solution with a second chemical, in which the second chemical is configured to form a plurality of bubbles in the developer solution. The applier is configured to apply the developer solution mixed with the bubbles onto a photoresist layer formed on a substrate, in which the photoresist layer has an exposed region, and the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction.

公开(公告)号：US11592748B2

公开(公告)日：2023-02-28

申请号：US16684457

申请日：2019-11-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Hsuan Chuang ,  Po-Sheng Lu ,  Shou-Wen Kuo ,  Cheng-Yi Huang ,  Chia-Hung Chu

IPC: G03F7/16 ,  H01L21/027 ,  G03F7/004

Abstract: A multi-spray RRC process with dynamic control to improve final yield and further reduce resist cost is disclosed. In one embodiment, a method, includes: dispensing a first layer of solvent on a semiconductor substrate while spinning at a first speed for a first time period; dispensing the solvent on the semiconductor substrate while spinning at a second speed for a second time period so as to transform the first layer to a second layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a third speed for a third time period so as to transform the second layer to a third layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a fourth speed for a fourth time period so as to transform the third layer to a fourth layer of the solvent; and dispensing a first layer of photoresist on the fourth layer of the solvent while spinning at a fifth speed for a fifth period of time.