公开(公告)号：US11056365B2

公开(公告)日：2021-07-06

申请号：US15800586

申请日：2017-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hom-Chung Lin ,  Jih-Churng Twu ,  Chin-Yun Chen ,  Tai-Hsiang Lin ,  Yu-Chi Tsai

IPC: H01L21/67 ,  H01L21/677 ,  G01N27/22 ,  G08B21/18 ,  G08B25/10 ,  G08B21/20

Abstract: A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a plurality of process events of a process run. The method further includes measuring humidity in the fabrication tool in at least one of the process events. The method also includes comparing the humidity measured in one of the process events with an expected humidity associated with the process event. In addition, the method includes based on the comparison, indicating an alarm condition when a difference between the measured humidity and the expected humidity exceeds a range of acceptable values associated with the process event.