公开(公告)号：US11569062B2

公开(公告)日：2023-01-31

申请号：US16882053

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hom-Chung Lin ,  Jih-Churng Twu ,  Yi-Ting Chang ,  Chao-Po Lu ,  Tsung-Min Lin

IPC: H01J37/31 ,  H01J37/317 ,  H01J37/08 ,  H01J37/32

Abstract: An ion implantation system includes an ion implanter containing an ion source unit and a dopant source gas supply system. The system includes a dopant source gas storage tank inside a gas box container located remotely to the ion implanter and a dopant source gas supply pipe configured to supply a dopant source gas from the dopant source gas storage tank to the ion source unit. The dopant source gas supply pipe includes an inner pipe, an outer pipe enclosing the inner pipe, a first pipe adaptor coupled to first end of respective inner and outer pipes, and a second pipe adaptor coupled to seconds end of respective inner and outer pipes opposite the first end. The first pipe adaptor connects the inner pipe to the dopant source gas storage tank and the second pipe adaptor connects the inner pipe to the ion source unit.

公开(公告)号：US11804392B2

公开(公告)日：2023-10-31

申请号：US17568611

申请日：2022-01-04

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hom-Chung Lin ,  Chi-Ying Chang ,  Jih-Churng Twu ,  Chin-Yun Chen ,  Yi-Ting Chang ,  Feng-Yu Chen

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67259 ,  H01L21/67763

Abstract: A method includes transferring a tool monitoring device to a load port of a tool. An environmental parameter of the load port is monitored by the tool monitoring device. The tool monitoring device is removed from the load port after the environmental parameter of the load port is monitored. A door of the tool in front of the load port is closed. The door of the tool is kept closed during a period from a time of transferring the tool monitoring device to the load port to a time of removing the tool monitoring device from the load port.

公开(公告)号：US11239099B2

公开(公告)日：2022-02-01

申请号：US16539708

申请日：2019-08-13

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hom-Chung Lin ,  Chi-Ying Chang ,  Jih-Churng Twu ,  Chin-Yun Chen ,  Yi-Ting Chang ,  Feng-Yu Chen

IPC: H01L21/67 ,  H01L21/677

Abstract: In some embodiments, a system for monitoring a tool is provided. The system includes a tool monitoring device, a transporting system and an external apparatus. The tool monitoring device is configured to monitor an environmental parameter of a load port of a tool. The tool monitoring device includes a wafer pod and a monitoring module disposed in the wafer pod. The monitoring module includes at least one sensor, a computer coupled to the at least one sensor, a power supply electrically coupled to the at least one sensor and the computer, and a wireless unit coupled to the computer. The transporting system is configured to transfer the tool monitoring device from one load port to another load port. The external apparatus is coupled to the tool monitoring device.

公开(公告)号：US11056365B2

公开(公告)日：2021-07-06

申请号：US15800586

申请日：2017-11-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hom-Chung Lin ,  Jih-Churng Twu ,  Chin-Yun Chen ,  Tai-Hsiang Lin ,  Yu-Chi Tsai

IPC: H01L21/67 ,  H01L21/677 ,  G01N27/22 ,  G08B21/18 ,  G08B25/10 ,  G08B21/20

Abstract: A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a plurality of process events of a process run. The method further includes measuring humidity in the fabrication tool in at least one of the process events. The method also includes comparing the humidity measured in one of the process events with an expected humidity associated with the process event. In addition, the method includes based on the comparison, indicating an alarm condition when a difference between the measured humidity and the expected humidity exceeds a range of acceptable values associated with the process event.