公开(公告)号：US20240383095A1

公开(公告)日：2024-11-21

申请号：US18786321

申请日：2024-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung CHEN ,  Yi-Shao LIN ,  Sheng-Tai PENG ,  Ya-Jen SHEUH ,  Hung-Lin CHEN ,  Ren-Dou LEE

IPC: B24B37/20 ,  B24B37/013 ,  B24B37/04 ,  C09G1/02

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.