公开(公告)号：US20240249906A1

公开(公告)日：2024-07-25

申请号：US18158357

申请日：2023-01-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Tang TSENG ,  Ching-Heng YEN ,  Tai-Kun KAO ,  Sheng-Tai PENG ,  Chun Yan CHEN

IPC: H01J37/08 ,  H01J37/317

CPC classification number: H01J37/08 ,  H01J37/3171 ,  H01J2237/0815

Abstract: An ion source head includes a curved liner that is configured to more closely and accurately repel, direct, or deflect ion species generated within an ion source cavity of an ion source container of an ion source head towards an ion beam opening that extends through the ion source container of the ion source head. This prevents or reduces the ion species from becoming trapped in the ion source cavity instead of exiting the ion source cavity through the ion beam opening that extends through the ion source container of the ion source head. The curved liner may be received by a curved structure of the ion source container of the ion source head. The ion source head may be utilized within an implanter tool to refine or process a solid target with the ion beam generated by the ion source head with the curved liner.

公开(公告)号：US20240383095A1

公开(公告)日：2024-11-21

申请号：US18786321

申请日：2024-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung CHEN ,  Yi-Shao LIN ,  Sheng-Tai PENG ,  Ya-Jen SHEUH ,  Hung-Lin CHEN ,  Ren-Dou LEE

IPC: B24B37/20 ,  B24B37/013 ,  B24B37/04 ,  C09G1/02

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.

公开(公告)号：US20240181598A1

公开(公告)日：2024-06-06

申请号：US18438148

申请日：2024-02-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung LAI ,  Cheng-Ping CHEN ,  Shih-Chung CHEN ,  Sheng-Tai PENG

IPC: B24B37/30 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67 ,  H01L21/677

CPC classification number: B24B37/30 ,  B24B37/042 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67742

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.