Boiling water nuclear reactor and emergency core cooling system of the same
    1.
    发明授权
    Boiling water nuclear reactor and emergency core cooling system of the same 有权
    沸水核反应堆和应急核心冷却系统相同

    公开(公告)号:US07983376B2

    公开(公告)日:2011-07-19

    申请号:US12828798

    申请日:2010-07-01

    IPC分类号: G21C9/00

    CPC分类号: G21C15/18 G21C9/004 Y02E30/31

    摘要: A boiling water nuclear reactor comprises: a reactor containment vessel including a dry well and a wet well; a vent pipe connecting the dry well and the pressure suppression pool; a gravity-driven water injection pool to hold boric acid aqueous solution; an emergency core water-injection piping system for causing the boric acid aqueous solution in the gravity-driven water injection pool to fall so as to be injected into the reactor pressure vessel in case of reactor accident; a static containment vessel cooling system pool; a static containment vessel cooling system heat exchanger; a dry well connection pipe connecting an upper part of the static containment vessel cooling system heat exchanger and the dry well; and a gas vent pipe for discharging noncondensible gas in the static containment vessel cooling system heat exchanger into the inside of the pressure suppression pool.

    摘要翻译: 沸水核反应堆包括:包括干井和湿井的反应堆安全壳; 连通干井和压力池的排气管; 用重力驱动的注水池来保持硼酸水溶液; 用于使重力驱动注水池中的硼酸水溶液落下以便在反应堆事故发生时被注入反应堆压力容器的应急核心注水管道系统; 静态容器冷却系统池; 静态容器冷却系统热交换器; 连接静电容器冷却系统热交换器的上部和干井的干井连接管; 以及用于将静电容器冷却系统热交换器中的不可冷凝气体排放到压力抑制池的内部的排气管。

    Pressurized water reactor plant
    2.
    发明授权
    Pressurized water reactor plant 有权
    加压水反应堆厂

    公开(公告)号:US08817941B2

    公开(公告)日:2014-08-26

    申请号:US13044909

    申请日:2011-03-10

    摘要: According to an embodiment, a pressurized water reactor plant has a primary system which includes: a reactor vessel for housing a reactor core which is cooled by a primary coolant, a single steam generator, a hot leg pipe for connecting the reactor vessel and the steam generator, cold leg pipes, at least two primary coolant pumps, and a pressurizer for pressurizing the primary coolant pressure boundary in which the primary coolant flows. The plant also has: a passive cooling and depressurization system which is a primary depressurization means for equalizing the primary system pressure to the secondary system pressure at the time of a tube rupture accident of the steam generator, and a reactor containment vessel containing the primary system and cooling the primary system by air cooling. Thus, a compact pressurized water rector with high economic efficiency, safety, and reliability can be provided.

    摘要翻译: 根据实施例,压水反应堆设备具有主要系统,其包括:用于容纳由主冷却剂冷却的反应堆堆芯的反应堆容器,单个蒸汽发生器,用于连接反应堆容器的热腿管和蒸汽 发电机,冷腿管,至少两个一次冷却剂泵,以及用于对初级冷却剂流动的主冷却剂压力边界加压的加压器。 该设备还具有:被动冷却和减压系统,其是在蒸汽发生器的管道破裂事故发生时使初级系统压力与二次系统压力相等的主要减压装置,以及包含主系统的反应堆安全壳 并通过空气冷却冷却主系统。 因此,可以提供具有高经济性,安全性和可靠性的紧凑型压水机。

    Emergency core cooling system
    3.
    发明授权
    Emergency core cooling system 有权
    应急核心冷却系统

    公开(公告)号:US07835482B2

    公开(公告)日:2010-11-16

    申请号:US11033272

    申请日:2005-01-12

    IPC分类号: G21C9/00

    CPC分类号: G21C15/18 Y02E30/31

    摘要: An emergency core cooling system comprises first and second safety divisions for an active emergency core cooling system. Each of the first and second safety divisions is provided with a high-pressure core cooling system and a low-pressure core cooling system, which also acts as a residual heat removal system.

    摘要翻译: 应急核心冷却系统包括用于主动应急核心冷却系统的第一和第二安全部门。 第一和第二安全部分中的每一个都设置有高压芯冷却系统和低压芯冷却系统,其还用作残余散热系统。

    BOILING WATER NUCLEAR REACTOR AND EMERGENCY CORE COOLING SYSTEM OF THE SAME
    5.
    发明申请
    BOILING WATER NUCLEAR REACTOR AND EMERGENCY CORE COOLING SYSTEM OF THE SAME 审中-公开
    锅炉水核反应堆及其应急核心冷却系统

    公开(公告)号:US20090060112A1

    公开(公告)日:2009-03-05

    申请号:US12056813

    申请日:2008-03-27

    IPC分类号: G21C9/004 G21C9/00

    CPC分类号: G21C15/18 G21C9/004 Y02E30/31

    摘要: A boiling water nuclear reactor comprises: a reactor containment vessel including a dry well and a wet well; a vent pipe connecting the dry well and the pressure suppression pool; a gravity-driven water injection pool to hold boric acid aqueous solution; an emergency core water-injection piping system for causing the boric acid aqueous solution in the gravity-driven water injection pool to fall so as to be injected into the reactor pressure vessel in case of reactor accident; a static containment vessel cooling system pool; a static containment vessel cooling system heat exchanger; a dry well connection pipe connecting an upper part of the static containment vessel cooling system heat exchanger and the dry well; and a gas vent pipe for discharging noncondensible gas in the static containment vessel cooling system heat exchanger into the inside of the pressure suppression pool.

    摘要翻译: 沸水核反应堆包括:包括干井和湿井的反应堆安全壳; 连通干井和压力池的排气管; 用重力驱动的注水池来保持硼酸水溶液; 用于使重力驱动注水池中的硼酸水溶液落下以便在反应堆事故发生时被注入反应堆压力容器的应急核心注水管道系统; 静态容器冷却系统池; 静态容器冷却系统热交换器; 连接静电容器冷却系统热交换器的上部和干井的干井连接管; 以及用于将静电容器冷却系统热交换器中的不可冷凝气体排放到压力抑制池的内部的排气管。

    Emergency core cooling system
    6.
    发明申请
    Emergency core cooling system 有权
    应急核心冷却系统

    公开(公告)号:US20050220259A1

    公开(公告)日:2005-10-06

    申请号:US11033272

    申请日:2005-01-12

    IPC分类号: G21C9/00 G21C15/18 G21D3/04

    CPC分类号: G21C15/18 Y02E30/31

    摘要: An emergency core cooling system comprises first and second safety divisions for an active emergency core cooling system. Each of the first and second safety divisions is provided with a high-pressure core cooling system and a low-pressure core cooling system, which also acts as a residual heat removal system.

    摘要翻译: 应急核心冷却系统包括用于主动应急核心冷却系统的第一和第二安全部门。 第一和第二安全部分中的每一个都设置有高压芯冷却系统和低压芯冷却系统,其还用作残余散热系统。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    7.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号:US20090215247A1

    公开(公告)日:2009-08-27

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在扫描装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Light illumination during wafer dicing to prevent aluminum corrosion
    8.
    发明授权
    Light illumination during wafer dicing to prevent aluminum corrosion 有权
    晶圆切割时的光照,防止铝腐蚀

    公开(公告)号:US07998793B2

    公开(公告)日:2011-08-16

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/00

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Manufacturing Method of Semiconductor Device
    9.
    发明申请
    Manufacturing Method of Semiconductor Device 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20080138962A1

    公开(公告)日:2008-06-12

    申请号:US11632993

    申请日:2004-07-22

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 通过照明装置(7a)和(7b)的晶片。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。