公开(公告)号：US20060239855A1

公开(公告)日：2006-10-26

申请号：US10562725

申请日：2004-07-01

申请人： Tetsuya Nakatsuka ,  Nobuhide Takano ,  Tadayuki Sugahara ,  Tomoyuki Omura ,  Toshio Saeki ,  Kouji Serizawa ,  Shousaku Ishihara

发明人： Tetsuya Nakatsuka ,  Nobuhide Takano ,  Tadayuki Sugahara ,  Tomoyuki Omura ,  Toshio Saeki ,  Kouji Serizawa ,  Shousaku Ishihara

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  B23K35/262 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K2203/111 ,  H05K2203/1572 ,  Y02P70/613

摘要： A hybrid mounting method using a Pb-free solder alloy including a reflow soldering step of soldering a surface mounting component 2 to at least the upper surface of a circuit board 1 using a Pb-free solder paste comprising an alloy based on Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit, mass %)-based alloy, an insertion step of inserting a lead or a terminal of an insertion mounting component 5 into a through hole perforated through the circuit board 1 from the upper surface thereof, a flux coating step, a preheating step, and a flow soldering step of spraying a jet flow 3 of Pb-free solder to the lower surface of the circuit board 1 preheated by the preheating step, thereby flow soldering the lead or the terminal of an insertion mounting component 5 to the circuit board.

摘要翻译： 一种使用无铅焊料合金的混合安装方法，其包括使用包含基于Sn-（1）的合金的无铅焊膏将至少表面安装部件2焊接到电路板1的至少上表面的回流焊步骤 -4）Ag-（0-1）Cu-（7-10）In（单位质量％）基合金，插入步骤，将插入安装部件5的引线或端子插入通孔穿孔 电路板1，其上表面包括焊剂涂布步骤，预热步骤和流动焊接步骤，其将无铅焊料的喷射流3喷射到由预热步骤预热的电路板1的下表面， 从而将插入安装部件5的引线或端子焊接到电路板。