公开(公告)号：US10801985B2

公开(公告)日：2020-10-13

申请号：US15173468

申请日：2016-06-03

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Mehmet Aslan

IPC: G01N27/22 ,  B82Y30/00 ,  G01N31/22 ,  H01L21/02 ,  H01L21/288 ,  H01L21/321 ,  H01L49/02

Abstract: An integrated circuit (IC) with an impedance sensor fabricated on a surface of the substrate is disclosed. The impedance sensor includes a bottom conductive plate formed on the substrate. A sensing membrane is formed on the bottom conductive plate. A top conductive plate is formed on the sensing membrane, in which the top conductive plate is a fusion of conductive nanoparticles having a random three dimensional porosity that is permeable to a reagent.

公开(公告)号：US20170350846A1

公开(公告)日：2017-12-07

申请号：US15173468

申请日：2016-06-03

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Mehmet Aslan

IPC: G01N27/22 ,  H01L21/02 ,  H01L21/288 ,  G01N31/22 ,  H01L49/02 ,  H01L21/321

Abstract: An integrated circuit (IC) with an impedance sensor fabricated on a surface of the substrate is disclosed. The impedance sensor includes a bottom conductive plate formed on the substrate. A sensing membrane is formed on the bottom conductive plate. A top conductive plate is formed on the sensing membrane, in which the top conductive plate is a fusion of conductive nanoparticles having a random three dimensional porosity that is permeable to a reagent.