公开(公告)号：US09155202B2

公开(公告)日：2015-10-06

申请号：US13757649

申请日：2013-02-01

Applicant: Thin Film Electronics ASA

Inventor： Zhigang Wang ,  Vivek Subramanian ,  Lee Cleveland

IPC: H05K1/00 ,  H05K3/12 ,  G06F17/50 ,  H05K3/00 ,  H01L23/532 ,  H05K1/16 ,  H05K1/02 ,  H01L51/00

CPC classification number: H05K3/0085 ,  G11C14/0054 ,  G11C17/14 ,  G11C17/18 ,  H01L23/5328 ,  H01L51/0022 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0296 ,  H05K1/16 ,  H05K3/125 ,  H05K2201/09245 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.

Abstract translation: 本发明的实施例涉及与打印电子墨水，通过印刷电子墨水或印刷和常规覆盖层沉积和光刻的组合形成的印刷电路的电路布局，以及通过将电子墨水印刷到具有印刷的结构上形成电路的方法 兼容的形状。 布局包括具有（i）打印兼容形状和（ii）与布局中的每个其他特征的取向正交或平行的取向的特征。