公开(公告)号：US20240094254A1

公开(公告)日：2024-03-21

申请号：US18527013

申请日：2023-12-01

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Tetsuo YOSHIDA ,  Shunsuke OTAKE ,  Tatsuya MATSUOKA

IPC: G01R1/073 ,  G01R1/067 ,  H01L21/67 ,  H01L21/687

CPC classification number: G01R1/07307 ,  G01R1/0675 ,  H01L21/67248 ,  H01L21/68707

Abstract: A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.