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公开(公告)号：US12105117B2
公开(公告)日：2024-10-01
申请号：US17369165
申请日：2021-07-07
Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
Inventor： Junji Oosaka , Osamu Hashiguchi
CPC classification number: G01R1/06722 , G01R1/07307
Abstract: An electrical component inspection instrument includes a substrate and a rod-shaped conductor component having one end for contact with a conductor of an electrical component which is an object to be inspected. A conductor pattern on a board surface of the substrate reaches an edge of the substrate, and the other end of the rod-shaped conductor component is electrically connected to the conductor pattern at the edge of the substrate. A direction in which the rod-shaped conductor component extends is orthogonal to the direction of the normal to the board surface of the substrate.
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公开(公告)号：US12099083B2
公开(公告)日：2024-09-24
申请号：US17680204
申请日：2022-02-24
Applicant: JTRON TECHNOLOGY CORP.
Inventor： Chen-Nan Chen
CPC classification number: G01R31/2808 , G01R1/07307
Abstract: A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof. The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.
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公开(公告)号：US20240302427A1
公开(公告)日：2024-09-12
申请号：US18344249
申请日：2023-06-29
Applicant: Leadpower-semi CO., LTD.
Inventor： Cheng-Jyun WANG , Po-Hsien LI , Jen-Hao YEH
CPC classification number: G01R31/2601 , G01R1/07307
Abstract: A test system includes a to-be-tested die including a to-be-tested transistor and a sense transistor, and a test device including a signal amplifying unit, a testing unit, and a probe card connecting the signal amplifying unit and the testing unit to the die. The signal amplifying unit has a first terminal connected to the to-be-tested transistor, and second and third terminals connected to the sense transistor. The signal amplifying unit stabilizes voltages at the second and third terminals based on a voltage at the first terminal, and generates an amplification voltage based on the voltages at the first to third terminals. The testing unit provides test signals to the to-be-tested transistor, determines magnitudes of currents flowing through the to-be-tested transistor and the sense transistor based on the test signals, the amplification voltage and a predetermined resistance, and thus acquires a current ratio to determine whether the die is defective.
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公开(公告)号：US20240201225A1
公开(公告)日：2024-06-20
申请号：US18391228
申请日：2023-12-20
Applicant: FormFactor, Inc.
Inventor： Kevin John Hughes , January Kister
IPC: G01R1/073
CPC classification number: G01R1/07307
Abstract: MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subject to both electrical and mechanical design constraints.
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公开(公告)号：US12000879B2
公开(公告)日：2024-06-04
申请号：US16997726
申请日：2020-08-19
Applicant: Technoprobe S.p.A.
Inventor： Roberto Subranni , David Heriban , Jean-Christophe Villain , Jocelyn Perreau , Florent Perrocheau , Anne Delettre
CPC classification number: G01R3/00 , G01R1/07307
Abstract: An apparatus for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, includes a support adapted to support at least two parallel guides, which are provided with a plurality of respective guides holes, and at least one holding means adapted to hold a contact probe to be housed in the guides holes, of the guides. Suitably, the support is a movable support adapted to be moved according to a preset trajectory between a first position, wherein the contact probe is held by the holding means at a predetermined position outside the guides holes, and a second position wherein the contact probe, which is held at the predetermined position, is housed in a set of guides holes that are substantially concentric to each other.
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Patent Agency Ranking
公开(公告)号：US11940465B2
公开(公告)日：2024-03-26
申请号：US17437152
申请日：2020-03-12
Applicant: NHK Spring Co., Ltd.
Inventor： Kazuya Soma , Masahiro Takahashi , Shuji Takahashi
CPC classification number: G01R1/07307 , H01R13/2421 , H01R12/714 , H01R2201/20
Abstract: A contact probe includes a first plunger, a second plunger, a coil spring, and a pipe; the first plunger includes a first slide portion that slides along the inner periphery of the pipe; the second plunger includes a second slide portion that slides along the inner periphery of the pipe; and the coil spring includes: a first attachment portion that is attached to the first plunger and tightly wound; a second attachment portion that is attached to the second plunger and tightly wound; a coarsely wound portion; a first contact portion including one end connected to the first attachment portion and another end connected to the coarsely wound portion and contacting the pipe; and a second contact portion including one end connected to the coarsely wound portion and another end connected to the second attachment portion and contacting to the pipe.
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公开(公告)号：US20240094636A1
公开(公告)日：2024-03-21
申请号：US17390835
申请日：2021-07-30
Applicant: Microfabrica Inc.
Inventor： Onnik Yaglioglu
CPC classification number: G03F7/09 , G01R1/07307 , G03F7/094
Abstract: Probe array formation embodiments of the invention (e.g., that are used to form full arrays or multi-probe subarrays that are to be assembled into full arrays) provide simultaneous formation of many probes of an array or subarray while the probes are in an array configuration. These embodiments provide for the creation and deformation of array formation templates that include holes or openings for depositing probe material wherein the openings are either fully formed (i.e. fully actualized) prior to deformation or are latently formed by chemical or structural changes to the template material
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公开(公告)号：US11860191B2
公开(公告)日：2024-01-02
申请号：US17608144
申请日：2020-06-19
Applicant: SUZHOU HYC TECHNOLOGY CO., LTD.
CPC classification number: G01R1/07307
Abstract: The present disclosure discloses a probe module, comprising: a body, a floating plate located at the bottom of the body and a probe assembly located on the side of the body which is far away from the floating plate. The probe assembly includes a cover plate, a mould core comprising pin grooves and blade pins each limited and fixed in the pin groove by a limiting member. The floating plate comprises pin holes, and the floating plate is configured to be floatable relative to the body in an extension direction of the blade pin and electrical contact terminals of the blade pins may be inserted into the pin holes from the surface of the floating plate close to the body and protrude from the surface of the floating plate which is far away from the body.
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公开(公告)号：US20230341439A1
公开(公告)日：2023-10-26
申请号：US18188936
申请日：2023-03-23
Applicant: CHOON LEONG LOU
Inventor： CHOON LEONG LOU
IPC: G01R1/073
CPC classification number: G01R1/07307
Abstract: The present disclosure provides a probe device. The probe device includes a first probe structure and a second probe structure. The first probe structure includes: a first body, a first substrate and a plurality of first probes. The first substrate is disposed on the first body. The first probes electrically connects to the first substrate and protrudes from a surface of the first substrate. The second probe structure includes: a second body, a second substrate and a plurality of second probes. The second body has a plurality of through holes. The second probes electrically connects to the second substrate and protrudes from a surface of the second body through the through holes. The length of the first probe is different from the length of the second probes.
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公开(公告)号：US20230243871A1
公开(公告)日：2023-08-03
申请号：US18295721
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/06722 , G01R1/07307
Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature comprising at least one laterally compressible spring element at a level above the lower retention feature that, in combination with the probe body, can be made to achieve a lateral configuration that is sized to pass through the hole and thereafter elastically return to a configuration that is incapable of passing through the hole so as to retain the probe and the array plate together.
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