公开(公告)号：US20140312266A1

公开(公告)日：2014-10-23

申请号：US14357768

申请日：2012-09-14

Applicant: UBMATERIALS Inc.

Inventor： Jea Gun Park ,  Gon Sub Lee ,  Jin Hyung Park ,  Jae Hyung Lim ,  Jong Young Cho ,  Hee Sub Hwang ,  Hao Cui

IPC: C23F1/14

CPC classification number: C23F1/14 ,  C09G1/02 ,  C09K3/1409 ,  H01L21/3212 ,  H01L21/7684

Abstract: Disclosed are a polishing slurry used in a polishing process of tungsten and a method of polishing using the same. The slurry includes an abrasive for performing polishing and an oxidation promoting agent for promoting the formation of an oxide. The abrasive includes titanium oxide particles.

Abstract translation: 公开了用于钨的抛光工艺的抛光浆料和使用其的抛光方法。 浆料包括用于进行抛光的研磨剂和用于促进氧化物形成的氧化促进剂。 研磨剂包括氧化钛颗粒。