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公开(公告)号:US20170338351A1
公开(公告)日:2017-11-23
申请号:US15191542
申请日:2016-06-24
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: ZHIBIAO ZHOU , Ding-Lung Chen , Chen-Bin Lin , SANPO WANG , Chung-Yuan Lee , Chi-Fa Ku
IPC: H01L29/786 , H01L29/788 , H01L29/792
CPC classification number: H01L29/78609 , H01L29/42328 , H01L29/42344 , H01L29/78648 , H01L29/7869 , H01L29/788 , H01L29/7881 , H01L29/792
Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a dielectric layer, a first gate electrode, a second gate electrode and a charge storage structure. The oxide-semiconductor layer is disposed on the first gate electrode on the substrate. The source/drain regions are disposed on the oxide-semiconductor layer. The first dielectric layer covers on the oxide-semiconductor layer and source/drain regions. A second gate electrode is disposed between source/drain regions and partially covers the oxide-semiconductor layer. The oxide-semiconductor layer may be optionally disposed between the first gate electrode and the oxide-semiconductor layer or be disposed on the second gate electrode.
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公开(公告)号:US20180138316A1
公开(公告)日:2018-05-17
申请号:US15853875
申请日:2017-12-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: ZHIBIAO ZHOU , Ding-Lung Chen , Chen-Bin Lin , SANPO WANG , Chung-Yuan Lee , Chi-Fa Ku
IPC: H01L29/786 , H01L29/792 , H01L29/788
CPC classification number: H01L29/78609 , H01L29/42328 , H01L29/42344 , H01L29/78648 , H01L29/7869 , H01L29/788 , H01L29/7881 , H01L29/792
Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a first dielectric layer covering on the oxide-semiconductor layer and the source/drain regions, a second gate between the two source/drain regions and partially covering the oxide-semiconductor layer, and a charge storage structure between the first gate electrode and the oxide-semiconductor layer.
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