公开(公告)号：US20220112078A1

公开(公告)日：2022-04-14

申请号：US17066448

申请日：2020-10-08

Applicant: X-Celeprint Limited

Inventor： Pierluigi Rubino

IPC: B81C1/00

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20240153933A1

公开(公告)日：2024-05-09

申请号：US18094276

申请日：2023-01-06

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  António José Marques Trindade ,  Pierluigi Rubino

IPC: H01L25/16 ,  B42D25/29 ,  B42D25/355 ,  F21S9/04 ,  F21V23/00 ,  H01L21/56 ,  H10N39/00

CPC classification number: H01L25/167 ,  B42D25/29 ,  B42D25/355 ,  F21S9/04 ,  F21V23/001 ,  F21V23/003 ,  H01L21/561 ,  H01L21/568 ,  H10N39/00 ,  H01L24/24

Abstract: A hybrid document includes a flexible document and a component having a component substrate disposed in or on the flexible document. One or more inorganic light-emitting diodes, a controller electrically connected to the one or more inorganic light-emitting diodes for controlling the one or more inorganic light-emitting diodes, and a piezoelectric power source are disposed on the component substrate. The power source can include a plurality of electrically connected individual piezoelectric power-source elements electrically connected to the controller, the inorganic light-emitting diodes, or both. Each of the one or more inorganic light-emitting diodes, the controller, the component substrate, or each of the individual piezoelectric power-source elements can comprise a broken or separated tether. The component substrate can be a flexible substrate that is more flexible than any one of the inorganic light-emitting diodes, the controller, and the individual piezoelectric power-source elements.

公开(公告)号：US20250042717A1

公开(公告)日：2025-02-06

申请号：US18646280

申请日：2024-04-25

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Pierluigi Rubino

IPC: B81B1/00 ,  H10N30/30

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20220112073A1

公开(公告)日：2022-04-14

申请号：US17475046

申请日：2021-09-14

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Pierluigi Rubino

IPC: B81B1/00 ,  H01L41/113

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US12006205B2

公开(公告)日：2024-06-11

申请号：US17475046

申请日：2021-09-14

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Pierluigi Rubino

IPC: B81B1/00 ,  H10N30/30

CPC classification number: B81B1/004 ,  H10N30/306 ,  B81B2201/058 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0353

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US11952266B2

公开(公告)日：2024-04-09

申请号：US17066448

申请日：2020-10-08

Applicant: X-Celeprint Limited

Inventor： Pierluigi Rubino

IPC: B81C1/00

CPC classification number: B81C1/00039 ,  B81C1/00523 ,  B81C1/00555 ,  B81C2201/0105 ,  B81C2201/013

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20220285291A1

公开(公告)日：2022-09-08

申请号：US17588888

申请日：2022-01-31

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Ronald S. Cok ,  Pierluigi Rubino

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16 ,  H01L25/13 ,  H01L25/18 ,  H01L25/075 ,  H01L25/00

Abstract: A micro-component module comprises a module substrate, a component disposed on the module substrate, and at least a portion of a module tether in contact with the module substrate. The module substrate can be flexible or can comprise an organic material, or both. The module tether can be more brittle and less flexible than the module substrate. The component can be less flexible than the module substrate and can comprise at least a portion of a component tether. An encapsulation layer can be disposed over the component and module substrate. The component can be disposed in a mechanically neutral stress plane of the micro-component module. A micro-component module system can comprise a micro-component module disposed on a flexible system substrate, for example by micro-transfer printing. A micro-component module can comprise an internal module cavity in the module substrate with internal module tethers physically connecting the module substrate to internal anchors.