公开(公告)号：US11373929B1

公开(公告)日：2022-06-28

申请号：US16780305

申请日：2020-02-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian Philofsky ,  Arun Kumar Varadarajan Rajagopal

IPC: H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/427

Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.