公开(公告)号：US11488887B1

公开(公告)日：2022-11-01

申请号：US16810473

申请日：2020-03-05

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Boon Y. Ang ,  Toshiyuki Hisamura ,  Suresh Parameswaran ,  Scott McCann ,  Hoa Lap Do

IPC: H01L23/367 ,  H01L21/306 ,  H01L23/00 ,  H01L23/373

Abstract: In one example, a method includes providing a first side of a semiconductor substrate with a plurality of transistors, etching a second side of the substrate, opposite the first side, with a pattern of trenches, the trenches having a pre-defined depth and width, and providing the etched semiconductor substrate in a package. In one example, the predefined depth and width of the trenches is such so as to increase the surface area of the second side of the substrate by at least 20 percent. In one example, the method also includes providing a layer of a thermal interface material (TIM) on the second side of the substrate, including to fill at least a portion of the trenches.

公开(公告)号：US11373929B1

公开(公告)日：2022-06-28

申请号：US16780305

申请日：2020-02-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian Philofsky ,  Arun Kumar Varadarajan Rajagopal

IPC: H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/427

Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.

公开(公告)号：US11328976B1

公开(公告)日：2022-05-10

申请号：US16808023

申请日：2020-03-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian D. Philofsky

IPC: H01L23/367 ,  H01L23/467 ,  H01L23/473 ,  H01L23/42

Abstract: Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.