公开(公告)号：US20240329329A1

公开(公告)日：2024-10-03

申请号：US18129765

申请日：2023-03-31

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Chuan Xie ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Nagadeven Karunakaran ,  Ferdinand F. Fernandez

IPC: G02B6/38 ,  G02B6/42

CPC classification number: G02B6/3849 ,  G02B6/381 ,  G02B6/4295

Abstract: A method of fabricating a chip package is provided, and a chip package fabricated using the same are provided. The method includes connecting a photonic die to a substrate of the chip package and attaching a protection apparatus to the substrate. The method also includes attaching a photonic connector to the photonic die. At least a portion of the photonic connector is disposed inside a housing of the protection apparatus. A fabrication process is performed on the chip package while the photonic connector is inside the housing. After processing, the photonic connector is removed from the housing.

公开(公告)号：US11605886B1

公开(公告)日：2023-03-14

申请号：US17133518

申请日：2020-12-23

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Lik Tsang ,  Jens Weis ,  Brendan Farley ,  Anthony Torza ,  Suresh Ramalingam

IPC: H01Q1/42 ,  H01L23/427 ,  H01Q1/02

Abstract: An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.

公开(公告)号：US11330738B1

公开(公告)日：2022-05-10

申请号：US17133525

申请日：2020-12-23

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Huayan Wang ,  Suresh Ramalingam ,  Volker Aue

IPC: H05K7/20 ,  H05K1/02 ,  H01Q1/00

Abstract: An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.

公开(公告)号：US11373929B1

公开(公告)日：2022-06-28

申请号：US16780305

申请日：2020-02-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian Philofsky ,  Arun Kumar Varadarajan Rajagopal

IPC: H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/427

Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.

公开(公告)号：US11328976B1

公开(公告)日：2022-05-10

申请号：US16808023

申请日：2020-03-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian D. Philofsky

IPC: H01L23/367 ,  H01L23/467 ,  H01L23/473 ,  H01L23/42

Abstract: Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.