Radome with integrated passive cooling

    公开(公告)号:US11605886B1

    公开(公告)日:2023-03-14

    申请号:US17133518

    申请日:2020-12-23

    Applicant: XILINX, INC.

    Abstract: An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.

    Force balanced package mounting
    3.
    发明授权

    公开(公告)号:US11330738B1

    公开(公告)日:2022-05-10

    申请号:US17133525

    申请日:2020-12-23

    Applicant: XILINX, INC.

    Abstract: An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.

    Three-dimensional thermal management apparatuses for electronic devices

    公开(公告)号:US11328976B1

    公开(公告)日:2022-05-10

    申请号:US16808023

    申请日:2020-03-03

    Applicant: XILINX, INC.

    Abstract: Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.

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