公开(公告)号：US20220407676A1

公开(公告)日：2022-12-22

申请号：US17351028

申请日：2021-06-17

Applicant: XILINX, INC.

Inventor： Wenfeng ZHANG ,  Zhaoyin Daniel WU ,  Parag UPADHYAYA

IPC: H04L7/00 ,  H04B1/16

Abstract: In one example, receiver circuitry for a communication system comprises signal processing circuitry configured to receive a data signal and generate a processed data signal, and error slicer circuitry. The error slicer circuitry is coupled to the output of the signal processing circuitry, and configured to receive the processed data signal. The error slicer circuitry comprises a first error slicer configured to receive a clock signal, and output a first error signal based on a first state of the clock signal and processed data signal. The first error slicer is further configured to output a second error signal based on a second state of the clock signal and the processed data signal.

公开(公告)号：US20240329110A1

公开(公告)日：2024-10-03

申请号：US18128942

申请日：2023-03-30

Applicant: XILINX, INC.

Inventor： Zhaoyin Daniel WU ,  Tianyu FANG ,  Chuen-Huei CHOU ,  Christopher J. BORRELLI ,  Geoffrey ZHANG

IPC: G01R31/11 ,  G01R31/52

CPC classification number: G01R31/11 ,  G01R31/52

Abstract: Using “in-situ on-die time-domain reflectometry (TDR)” with data signal paths of integrated circuits, printed circuit boards, and data processing equipment and systems allows testing, verification and troubleshooting of data channel signal path impedance variations including the package, escape routing, socket, board, and cable/connectors provides fast characterization thereof. Operation of “in-situ on-die TDR” uses existing analog-to-digital converter (ADC) and data transmitter (TX) drivers of an integrated circuit to act as a TDR sampling head by performing a user interface-based TDR sampling with a step-waveform generated by an integrated circuit TX driver. Then sampling the step-waveform with the ADC of the integrated circuit using spline interpolation to obtain the over-sampled waveform. Once the sampled step-waveform is obtained, the TDR profile of the sampled data channels may be calculated. Large amounts of impedance variation data may thus be collected during either integrated circuit manufacturer or customer-built data communications channel testing.

公开(公告)号：US20220415788A1

公开(公告)日：2022-12-29

申请号：US17357087

申请日：2021-06-24

Applicant: XILINX, INC.

Inventor： Zhaoyin Daniel WU ,  Parag UPADHYAYA ,  Hong SHI

IPC: H01L23/522 ,  H01Q1/22

Abstract: A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.